{"title":"Overview of recent advances on isotropic conductive adhesives","authors":"D. Lu, C. Wong","doi":"10.1109/HDP.2006.1707596","DOIUrl":null,"url":null,"abstract":"Lead-free and environmentally sound interconnect bonding processes are urgently needed. Among the possibilities are electrically conductive adhesives (ECAs) and lead-free solders (Codenhead, R. and DeCoursy, D., 1985). Compared to soldering technology, ECA technology can offer numerous advantages such as fewer processing steps which reduces processing cost, lower processing temperature which makes the use of heat-sensitive and low cost substrate possible, and fine pitch capability","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"157 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HDP.2006.1707596","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
Lead-free and environmentally sound interconnect bonding processes are urgently needed. Among the possibilities are electrically conductive adhesives (ECAs) and lead-free solders (Codenhead, R. and DeCoursy, D., 1985). Compared to soldering technology, ECA technology can offer numerous advantages such as fewer processing steps which reduces processing cost, lower processing temperature which makes the use of heat-sensitive and low cost substrate possible, and fine pitch capability
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