Multifunction Force Sensor with Hollow Structure

Yu-Hao Jen, Chia-Tso Mo, Yu-Wen Chen, C. Lo
{"title":"Multifunction Force Sensor with Hollow Structure","authors":"Yu-Hao Jen, Chia-Tso Mo, Yu-Wen Chen, C. Lo","doi":"10.1109/FLEPS49123.2020.9239471","DOIUrl":null,"url":null,"abstract":"In this study, the material of the dielectric layer was changed to reduce the structural rigidity of a capacitive tactile sensor, achieving the result of increasing the detection sensitivity without affecting the spatial resolution. Simulation and experimental results showed that the sensitivity of the sensor can be greatly improved by changing the elastomeric dielectric layer from a solid structure to a hollow structure. When the normal force was 0.25 N, the average detection sensitivity of the hollow structure was 32 pF/ N. Compared with the solid counterpart, the sensitivity was increased by roughly 600 times. When the shear force was 1.5 N, the average detection sensitivity of the hollow structure was 0.1 pF/N. Compared with the solid counterpart, it showed an improvement of at least five times regardless of the shear angle. In addition, the measured shear angle exhibited a tolerance of no more than 4°, which was similar to the announced sensors.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/FLEPS49123.2020.9239471","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

In this study, the material of the dielectric layer was changed to reduce the structural rigidity of a capacitive tactile sensor, achieving the result of increasing the detection sensitivity without affecting the spatial resolution. Simulation and experimental results showed that the sensitivity of the sensor can be greatly improved by changing the elastomeric dielectric layer from a solid structure to a hollow structure. When the normal force was 0.25 N, the average detection sensitivity of the hollow structure was 32 pF/ N. Compared with the solid counterpart, the sensitivity was increased by roughly 600 times. When the shear force was 1.5 N, the average detection sensitivity of the hollow structure was 0.1 pF/N. Compared with the solid counterpart, it showed an improvement of at least five times regardless of the shear angle. In addition, the measured shear angle exhibited a tolerance of no more than 4°, which was similar to the announced sensors.
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中空结构多功能力传感器
本研究通过改变介质层的材料来降低电容式触觉传感器的结构刚度,在不影响空间分辨率的情况下达到了提高检测灵敏度的效果。仿真和实验结果表明,将弹性体介电层由固体结构改为空心结构,可以大大提高传感器的灵敏度。当法向力为0.25 N时,空心结构的平均检测灵敏度为32 pF/ N,与固体结构相比,灵敏度提高了约600倍。当剪切力为1.5 N时,空心结构的平均检测灵敏度为0.1 pF/N。与固体材料相比,无论剪切角如何,它都显示出至少五倍的改善。此外,测量的剪切角公差不超过4°,这与公布的传感器相似。
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