The interaction of hot electrons and hot holes on the degradation of P-channel metal oxide semiconductor field effect transistors

Z.J. Yang, F. Guarín, S. Rauch
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引用次数: 3

Abstract

The hot carrier degradation mechanisms for P Channel metal-oxide-semiconductor (MOS) field effect transistor (PFET) has been investigated. We have established that the dominant hot carrier degradation mechanism for PFET damage changes depending on stress conditions. The coexistence and interaction of hot electrons and hot holes is reported. At the accelerated stress condition where both hot electrons and hot holes exist, the observed hot carrier degradation exhibits a different behavior from that seen in the case when the hot electrons or hot holes are considered separately. A high defect generation rate is reported at the coexistence conditions. We attribute this behavior to the interaction mechanism between hole electrons and hot holes. The electron traps caused by hot electrons recombine with hot holes and facilitate a higher hole trap generation rate. Contrary to conventional thinking we report that the worst case hot carrier degradation degradation condition is not at high Vg but in the coexistence regime.
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热电子与热空穴相互作用对p沟道金属氧化物半导体场效应晶体管退化的影响
研究了P沟道金属氧化物半导体(MOS)场效应晶体管(pet)的热载子降解机理。我们已经确定了pet损伤的主要热载流子降解机制取决于应力条件的变化。报道了热电子与热空穴的共存和相互作用。在同时存在热电子和热空穴的加速应力条件下,观察到的热载子降解表现出与单独考虑热电子或热空穴时不同的行为。在共存条件下,缺陷产生率较高。我们将这种行为归因于空穴电子与热空穴之间的相互作用机制。由热电子引起的电子陷阱与热空穴重新结合,促进了更高的空穴陷阱产生率。与传统的想法相反,我们报告了最坏情况下的热载流子降解降解条件不是在高Vg,而是在共存状态。
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