T. Pinili, R. Manolo, A. Denoyo, B. Yabut, D. Moore, B. Cowell, J. Jenson, K. Truong, J. Gambino, R. Watkins, W. Qin, G. Brizar, J. De Clerq
{"title":"Copper Wire Bond Optimization for Power Devices","authors":"T. Pinili, R. Manolo, A. Denoyo, B. Yabut, D. Moore, B. Cowell, J. Jenson, K. Truong, J. Gambino, R. Watkins, W. Qin, G. Brizar, J. De Clerq","doi":"10.1109/IPFA.2018.8452561","DOIUrl":null,"url":null,"abstract":"We report on bond pad damage for a smart power device using 50.8 µm (2 mil) diameter Pd-coated Cu wire. We show that the damage can be relatively subtle; the wire bonds on damaged structures have high pull and shear strength, but cracks in the underlying regions lead to metal extrusions that cause electrical shorts.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452561","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
We report on bond pad damage for a smart power device using 50.8 µm (2 mil) diameter Pd-coated Cu wire. We show that the damage can be relatively subtle; the wire bonds on damaged structures have high pull and shear strength, but cracks in the underlying regions lead to metal extrusions that cause electrical shorts.
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