Ni-Au surface finish effects on RF performance

D. Staiculescu, J. Laskar, J. Mendelsohn, E. Sweetman, D. Rudy, I. Anaki
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引用次数: 9

Abstract

We present a simplified analysis of the Nickel-Gold surface finish effects on microstrip conductive losses for boards with different Ni thickness and Ni/Au finish chemistries. Otherwise identical test structures were fabricated with various Ni/Au finishes and different thicknesses. The conductive loss has been extracted from Q measurements on series microstrip resonators. A theoretical model for conductor loss of a two metal layer system has also been proposed. The theoretical approach has been supported with measurement results. For a specific frequency, conductive loss shows an S-curve behavior with Ni thickness.
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Ni-Au表面处理对射频性能的影响
本文对镍金表面处理对不同镍厚度和镍金表面处理化学性质的微带导电损耗的影响进行了简化分析。另外,用不同的Ni/Au饰面和不同的厚度制作相同的测试结构。从串联微带谐振器的Q测量中提取了导电损耗。本文还提出了两金属层体系导体损耗的理论模型。理论方法得到了实测结果的支持。在特定频率下,导电损耗随Ni厚度呈s曲线变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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