Fast Electromigration Simulation for Chip Power Grids

B. Shahriari, F. Najm
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Abstract

Electromigration (EM) continues to be a serious concern for large chip design. We are focused on EM in the on-chip power grid, because grid lines carry mostly unidirectional currents and because of the very large sizes of modern grids. In the last few years, the capability to simulate EM has become available by simulating the stress in metal lines, which is the main cause of EM-induced failures. In this work, we have improved on the state of the art by developing a new EM simulator that is both faster and has better features than previous work. The work builds on recent results on the equivalence between stress and voltage, and introduces both a model reduction technique that provides up to 4.2X speedup, and a very efficient method for updating the grid currents during the void growth phase.
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芯片电网的快速电迁移仿真
电迁移(EM)仍然是大型芯片设计的一个严重问题。我们专注于芯片上电网中的电磁,因为电网线路大多携带单向电流,而且现代电网的规模非常大。在过去的几年里,通过模拟金属线中的应力来模拟电磁的能力已经成为可能,金属线中的应力是电磁诱发失效的主要原因。在这项工作中,我们通过开发一种新的EM模拟器来改进目前的技术水平,该模拟器比以前的工作更快,并且具有更好的功能。这项工作建立在应力和电压之间等效性的最新研究结果的基础上,并引入了一种提供高达4.2倍加速的模型简化技术,以及一种在空隙生长阶段非常有效地更新网格电流的方法。
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