Tianshi Xie, Jianglin Zhu, Tom Byrd, D. Maksimović, Hanh-Phuc Le
{"title":"A 0.66 W/mm2 Power Density, 92.4% Peak Efficiency Hybrid Converter with nH-Scale Inductors for 12 V System","authors":"Tianshi Xie, Jianglin Zhu, Tom Byrd, D. Maksimović, Hanh-Phuc Le","doi":"10.1109/CICC53496.2022.9772862","DOIUrl":null,"url":null,"abstract":"As passive components play a critical role in determining the overall footprint of power management solutions, significant efforts have been put into new converter topologies, operating principles, and packaging techniques aimed at reducing the size of passive components [1]–[5]. To achieve these goals, one can increase the effective switching frequency [3]–[5], or use hybrid converter topologies and/or resonant operation to better utilize inductors and capacitors for power transfer. Packaging that prioritizes close proximity and low parasitics is also of particular interest [5]. Starting from the preliminary discrete-circuit implementation in [6], this work strives to achieve the high-density goals based on a new integrated hybrid converter topology and operation, high switching frequency, and advanced packaging, which collectively enable the use of nano-Henry scale inductors. The prototype is fabricated in 3.23 mm2 of a 1P6M 0.13 µm BCD process (Die micrograph).","PeriodicalId":415990,"journal":{"name":"2022 IEEE Custom Integrated Circuits Conference (CICC)","volume":"105 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Custom Integrated Circuits Conference (CICC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC53496.2022.9772862","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
As passive components play a critical role in determining the overall footprint of power management solutions, significant efforts have been put into new converter topologies, operating principles, and packaging techniques aimed at reducing the size of passive components [1]–[5]. To achieve these goals, one can increase the effective switching frequency [3]–[5], or use hybrid converter topologies and/or resonant operation to better utilize inductors and capacitors for power transfer. Packaging that prioritizes close proximity and low parasitics is also of particular interest [5]. Starting from the preliminary discrete-circuit implementation in [6], this work strives to achieve the high-density goals based on a new integrated hybrid converter topology and operation, high switching frequency, and advanced packaging, which collectively enable the use of nano-Henry scale inductors. The prototype is fabricated in 3.23 mm2 of a 1P6M 0.13 µm BCD process (Die micrograph).