{"title":"Low Cost MMIC Insertion Using Thick Film Processing","authors":"A. Bettner, B. Hundley, P. Salisbury","doi":"10.1109/MCS.1987.1114532","DOIUrl":null,"url":null,"abstract":"Multilayer thick-film circuits have been developed to provide single supply biasing and reactive matching to MMIC chips. The result is a method of achieving large amounts of gain at extremely low cost.","PeriodicalId":231710,"journal":{"name":"Microwave and Millimeter-Wave Monolithic Circuits","volume":"70 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microwave and Millimeter-Wave Monolithic Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCS.1987.1114532","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Multilayer thick-film circuits have been developed to provide single supply biasing and reactive matching to MMIC chips. The result is a method of achieving large amounts of gain at extremely low cost.
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