{"title":"Physical Design Automation Challenges for 3D ICs","authors":"S. Sapatnekar","doi":"10.1109/ICICDT.2006.220820","DOIUrl":null,"url":null,"abstract":"Recent advances in process technology have brought forth several options that have brought three-dimensional (3D) circuits within the realm of the possible and probable. This new design paradigm requires a major change in design methodologies, and an optimal 3D design looks very different from an optimal 2D design. Since the move from conventional 2D to 3D is inherently a topological change, it stands to reason that a number of 3D-specific problems lie in the domain of physical design. This paper addresses challenges related to physical design for 3D integrated circuits","PeriodicalId":447050,"journal":{"name":"2006 IEEE International Conference on IC Design and Technology","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE International Conference on IC Design and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICDT.2006.220820","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
Recent advances in process technology have brought forth several options that have brought three-dimensional (3D) circuits within the realm of the possible and probable. This new design paradigm requires a major change in design methodologies, and an optimal 3D design looks very different from an optimal 2D design. Since the move from conventional 2D to 3D is inherently a topological change, it stands to reason that a number of 3D-specific problems lie in the domain of physical design. This paper addresses challenges related to physical design for 3D integrated circuits
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