{"title":"Fine pitch gold ball bonding optimization","authors":"W.K. Shu","doi":"10.1109/IEMT.1993.398224","DOIUrl":null,"url":null,"abstract":"Response surface methodology is used to characterize a state-of-the-art wire bonder with a bottleneck capillary for fine pitch bonding. Regression analysis generates mathematical models to plot 3-D charts and contour charts of ball size and ball shear force as a function of wire bond parameters. A procedure is described to use contour charts to optimize bonding parameters. Bonding windows are identified by using bonding specification requirements and material/process constraints as boundary conditions.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"1 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.398224","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Response surface methodology is used to characterize a state-of-the-art wire bonder with a bottleneck capillary for fine pitch bonding. Regression analysis generates mathematical models to plot 3-D charts and contour charts of ball size and ball shear force as a function of wire bond parameters. A procedure is described to use contour charts to optimize bonding parameters. Bonding windows are identified by using bonding specification requirements and material/process constraints as boundary conditions.<>
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