Fabrication of gold multi-electrode array with bi-layer lift-off resist technique and surface modification with gold nanoparticles by electrochemical deposition

Yong Hee Kim, N. S. Baek, G. Kim, Ah-young Kim, Young Hwan Han, Sang-Don Jung
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引用次数: 1

Abstract

Electrochemical deposition of gold nanoparticles (Au NPs) on the gold multi-electrode array (MEA) fabricated with bi-layer lift-off resist sputter-deposition technique was performed. Electrochemical deposition was performed by potentiostatic and cyclic voltammetry method. The surface of Au NP-modified electrode showed various morphologies with applied voltage and the concentration of HAuCl4 solution. The Au NP-modified electrode was characterized by electrochemical impedance spectroscopy and cyclic voltammogram. The performance of Au NP-modified MEA was also tested by neuronal signal recording. The Au NP-modified MEA exhibited lower baseline noises and can record neuronal spike signals longer than the bare Au MEA.
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双层抗蚀剂技术制备金多电极阵列及电化学沉积金纳米粒子表面修饰
研究了金纳米粒子(Au NPs)在双层抗溅射沉积技术制备的金多电极阵列(MEA)上的电化学沉积。采用恒电位法和循环伏安法进行电化学沉积。Au - np修饰电极表面随施加电压和HAuCl4溶液浓度的变化呈现出不同的形貌。采用电化学阻抗谱和循环伏安法对金纳米修饰电极进行了表征。通过神经元信号记录测试了Au np修饰的MEA的性能。Au np修饰的MEA具有较低的基线噪声,并且可以记录比裸Au MEA更长时间的神经元峰值信号。
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