{"title":"Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging","authors":"Hongjin Jiang, K. Moon, C. Wong","doi":"10.1007/978-1-4419-0040-1_8","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":418916,"journal":{"name":"Nano-Bio- Electronic, Photonic and MEMS Packaging","volume":"72 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nano-Bio- Electronic, Photonic and MEMS Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/978-1-4419-0040-1_8","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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