In vestigation the Impact of Silicon Film Thickness on FDSOI and PDSOI MOSFET Characteristics

Towhid A. Chowdhury
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Abstract

The performance of chip is degraded because of the short-channel effect (SCE) as the metal oxide semiconductor field effect transistor (MOSFET) size scales down. Silicon on insulator (SOI) technology helps to reduce the short channel effects and permits a good solution to the miniaturization. The electrical characteristics of fully depleted SOI (FDSOI) and partially depleted SOI (PDSOI) n-channel MOSFET (N-MOSFET) are investigated as silicon film thickness is varied in this paper. Both transistors are compared in terms of electrical parameters which are the threshold voltage, subthreshold slope, on-state current, leakage current and drain induced barrier lowering (DIBL). Silvaco TCAD tools are used for simulating both PDSOI and FDSOI MOSFETs. FDSOI MOSFET is superior to PDSOI MOSFET based on found simulation results.
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研究了硅膜厚度对FDSOI和PDSOI MOSFET特性的影响
随着金属氧化物半导体场效应晶体管(MOSFET)尺寸的减小,短通道效应(SCE)会降低芯片的性能。绝缘体上硅(SOI)技术有助于减少短通道效应,为微型化提供了一个很好的解决方案。本文研究了完全耗尽SOI (FDSOI)和部分耗尽SOI (PDSOI) n沟道MOSFET (N-MOSFET)在硅膜厚度变化时的电学特性。比较了两种晶体管的电学参数,即阈值电压、亚阈值斜率、导通电流、泄漏电流和漏极感应势垒降低(DIBL)。Silvaco TCAD工具用于模拟PDSOI和FDSOI mosfet。仿真结果表明,FDSOI MOSFET优于PDSOI MOSFET。
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