{"title":"Modelling and Design of Millimetrewave Passive Circuits: from 2 to 3D","authors":"R. Sorrentino","doi":"10.1109/EUMA.1994.337197","DOIUrl":null,"url":null,"abstract":"With the advances of microwave and millimetrewave circuit technology, fullwave electromagnetic approach has become necessary to model a number of phenomena (proximity effects, package interaction, crosstalk, etc.) dependent on complicated 3-D circuit configurations (multilevel circuits, vertical integration, multichip modules, finite metal thickness, etc.). This paper addresses a number of issues and reviews recent advances relevant to the modelling and optimisation of modern microwave circuits.","PeriodicalId":440371,"journal":{"name":"1994 24th European Microwave Conference","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 24th European Microwave Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUMA.1994.337197","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
With the advances of microwave and millimetrewave circuit technology, fullwave electromagnetic approach has become necessary to model a number of phenomena (proximity effects, package interaction, crosstalk, etc.) dependent on complicated 3-D circuit configurations (multilevel circuits, vertical integration, multichip modules, finite metal thickness, etc.). This paper addresses a number of issues and reviews recent advances relevant to the modelling and optimisation of modern microwave circuits.
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