{"title":"Photoelastic and numerical investigation of thermally-induced restrained shrinkage stresses in plastics","authors":"T. Sullivan, J. Rosenberg, S. Matsuoka","doi":"10.1109/ITHERM.1988.28678","DOIUrl":null,"url":null,"abstract":"A photoelastic analysis is used to determine stress distributions within an epoxy encapsulation material for idealized geometries. Experimental results are compared with analytical and numerical predictions based on actual material data. It is demonstrated that to determine quantitative stress levels using photoelasticity it is necessary to separate orientation effects from an elastically active portion of stress. These 'elastic' stress levels are predicted using linear elastic finite-element models, and agreement with experimental data is obtained when appropriate input parameters are chosen.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.1988.28678","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
A photoelastic analysis is used to determine stress distributions within an epoxy encapsulation material for idealized geometries. Experimental results are compared with analytical and numerical predictions based on actual material data. It is demonstrated that to determine quantitative stress levels using photoelasticity it is necessary to separate orientation effects from an elastically active portion of stress. These 'elastic' stress levels are predicted using linear elastic finite-element models, and agreement with experimental data is obtained when appropriate input parameters are chosen.<>
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
