An Introduction of Strip Chopping Cut Method to Establish a Robust Strip Based Dicing Process on Tape Dicing Concept

Abstract

Tape dicing concept is most commonly used in miniature QFN package singulation process due to its low operating cost and high throughput [1]. Processing with strip based material, starting from saw singulation to unit transfer into reel tape, while sawn unit still intact on dicing tape, robust process is needed as well as short cycle time for productivity. Currently, there are 2 common tape dicing methods. Firstly, strip cutting method, and secondly, strip to panel cutting method [2]. Both methods have pros & cons respectively. Nevertheless, in order to improve cycle time, extreme processing method is needed without jeopardizing the processing quality. Introducing this strip chopping cut method enables singulation process of maximum unit density per 12 inches wafer ring and processing abnormal lead frame design with thick metal side rail and moulded-only layer on panel. This method needs dicing blade to directly touch down on top of moulded package during cutting without fully cut metal side rail. In this paper, will further discuss in details how it works and what are the pros and cons, as well as its benefits.