0.075 × 0.075 mm2 ultra-small 7.5 μm ultra-thin RFID-chip mounting technology

H. Noda, M. Usami
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引用次数: 5

Abstract

An ultra-small (0.075x0.075-mm area) ultra-thin (7.5-mum thickness) radio-frequency identification (RFID) chip, called a "mu-chip," is expected to be adopted in applications like counterfeit prevention and product tracking of paper media and other small goods. For adoption in these applications, technology for mounting a mu-chip on an external antenna must be developed. Accordingly, we have developed a new technique for handling ultra-small mu-chips (called the "UH technique") by means of an automated apparatus. By the UH technique, the mu-chips are kept dispersed by liquid agitation, and only a single chip is captured and manipulated by micropipette. The efficiency of capturing a single mu-chip depends on the micropipette configuration, number of chips, and mu-chip stock solutions. A flat-end glass capillary micropipette with an inner and outer diameter of, respectively, 41 and 87 mum, which was treated by an optic-fiber cleaver, only successfully captured a single chip with an ideal orientation. The yield rate of capturing a single mu-chip, picked up from various types of liquid solutions, was investigated. This investigation found that a surfactant addition to the mu-chip stock solutions effectively prevented sticking between chips. In single-chip capturing performed in 0.5% NP-40, yield rate was 62%. Mounting of single mu-chips on films with constant 0.7-mm pitch was demonstrated. The time needed for an automated procedure for manipulating 100 chips was 44 min (26.4 s/chip).
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0.075 × 0.075 mm2超小型7.5 μm超薄rfid芯片安装技术
被称为“mu-chip”的超小型(0.075 × 0.075毫米)超薄(7.5毫米厚)射频识别(RFID)芯片预计将用于纸质介质和其他小商品的防伪和产品跟踪等应用。为了在这些应用中采用,必须开发在外部天线上安装mu芯片的技术。因此,我们开发了一种通过自动化设备处理超小型微芯片的新技术(称为“UH技术”)。通过UH技术,微晶片通过液体搅拌保持分散,只有一个微晶片被微移液管捕获和操作。捕获单个微芯片的效率取决于微移液管配置、芯片数量和微芯片库存解决方案。内径为41 μ m,外径为87 μ m的平板玻璃毛细管微移液管经光纤切割刀处理后,仅成功捕获了具有理想方向的单个芯片。研究了从不同类型的液体溶液中捕获单个微芯片的收率。研究发现,在微晶片原液中加入表面活性剂可以有效地防止微晶片之间的粘连。在0.5% NP-40中进行单芯片捕获,收率为62%。演示了单芯片在0.7 mm固定间距薄膜上的安装。操作100个芯片的自动程序所需时间为44分钟(26.4秒/芯片)。
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