{"title":"Ni Diffusion Behavior and Bondability of Electroless NiP/PdP/Au Film","authors":"Akifumi Kurachi, Katsuyuki Tsuchida, T. Kawai","doi":"10.1109/ISSM51728.2020.9377511","DOIUrl":null,"url":null,"abstract":"The Ni diffusion behavior of electroless NiP/PdP/Au film was investigated using Auger electron spectroscopy in this study. The diffusion coefficient of Ni in PdP was estimated from concentration profile by Einstein-Smoluchowski equation and Boltzman-Matano method. The obtained value was 3.5 ~4.7⨯10–20 m2s-1at 553 K. Furthermore, the bondability of the NiP/PdP/Au film before and after heat treatment was also studies to clarify the bonding reliability of the film of various thickness. Thicker NiP/PdP/Au film condition achieved high bonding reliability at least under the condition of this study.","PeriodicalId":270309,"journal":{"name":"2020 International Symposium on Semiconductor Manufacturing (ISSM)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International Symposium on Semiconductor Manufacturing (ISSM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM51728.2020.9377511","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The Ni diffusion behavior of electroless NiP/PdP/Au film was investigated using Auger electron spectroscopy in this study. The diffusion coefficient of Ni in PdP was estimated from concentration profile by Einstein-Smoluchowski equation and Boltzman-Matano method. The obtained value was 3.5 ~4.7⨯10–20 m2s-1at 553 K. Furthermore, the bondability of the NiP/PdP/Au film before and after heat treatment was also studies to clarify the bonding reliability of the film of various thickness. Thicker NiP/PdP/Au film condition achieved high bonding reliability at least under the condition of this study.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
