An introduction to an array memory processor for application specific acceleration

G. Pechanek, N. Pitsianis
{"title":"An introduction to an array memory processor for application specific acceleration","authors":"G. Pechanek, N. Pitsianis","doi":"10.1109/HPEC.2017.8091069","DOIUrl":null,"url":null,"abstract":"In this paper, we introduce an Array Memory (AM) processor. The AM processor uses a shared memory network amenable to on-chip 3D stacking. Node couplings use a 1 to K adjacency of connections in each dimension of communication of an array of nodes, such as an R×C array where R ≥ K and C ≥ K and K is a positive odd integer. This design also provides data sharing between processors within sub-arrays of the R × C array to support high-performance programmable application specific processing. A new instruction set architecture is proposed that has arithmetic instructions that do not require the specification of any source or target operand addresses. The source operands and target values are provided by separate load, store, and arithmetic instructions that are appropriately scheduled with the arithmetic instruction to be executed to reduce the storage of temporary variables for lower power implementations.","PeriodicalId":364903,"journal":{"name":"2017 IEEE High Performance Extreme Computing Conference (HPEC)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE High Performance Extreme Computing Conference (HPEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HPEC.2017.8091069","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

In this paper, we introduce an Array Memory (AM) processor. The AM processor uses a shared memory network amenable to on-chip 3D stacking. Node couplings use a 1 to K adjacency of connections in each dimension of communication of an array of nodes, such as an R×C array where R ≥ K and C ≥ K and K is a positive odd integer. This design also provides data sharing between processors within sub-arrays of the R × C array to support high-performance programmable application specific processing. A new instruction set architecture is proposed that has arithmetic instructions that do not require the specification of any source or target operand addresses. The source operands and target values are provided by separate load, store, and arithmetic instructions that are appropriately scheduled with the arithmetic instruction to be executed to reduce the storage of temporary variables for lower power implementations.
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介绍用于特定应用程序加速的阵列存储器处理器
本文介绍了一种阵列存储器(AM)处理器。AM处理器使用可适应片上3D堆叠的共享存储器网络。节点耦合在节点数组的通信的每个维度上使用1到K的邻接连接,例如R×C数组,其中R≥K, C≥K, K为正奇数。该设计还提供了R × C阵列子阵列内处理器之间的数据共享,以支持高性能可编程应用特定处理。提出了一种新的指令集结构,它的算术指令不需要指定任何源或目标操作数地址。源操作数和目标值由单独的加载、存储和算术指令提供,这些指令与要执行的算术指令进行适当的调度,以减少用于低功耗实现的临时变量的存储。
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