In situ thickness monitor for conducting films

S. A. Khan, J. Farmer, R. Gutmann, J. Borrego
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Abstract

A microwave probe for measuring the thickness of conducting films has been fabricated and characterized. A difference of up to 20 dB has been demonstrated between the two extrema of very small and infinitely large sheet resistivity for conducting films deposited on Si. Since the return loss will change by this amount as film thickness is increased from zero, simulation results indicate that the probe should be very effective in measuring the thickness of typical adhesion layers/diffusion barriers in VLSI and as an end-point detector in metal etching.<>
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导电薄膜的原位厚度监测器
制备了一种用于测量导电膜厚度的微波探针,并对其进行了表征。对于沉积在硅上的导电薄膜,在极小片电阻率和无限大片电阻率两个极值之间的差异可达20 dB。由于随着薄膜厚度从零增加,回波损耗也会随之变化,因此仿真结果表明,该探针在测量VLSI中典型粘附层/扩散屏障的厚度以及作为金属蚀刻的端点探测器方面应该非常有效
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