{"title":"Design of a candidate thermal control system for a cryogenically-cooled computer","authors":"R. Krane, J. Parsons, A. Bar-Cohen","doi":"10.1109/ITHERM.1988.28690","DOIUrl":null,"url":null,"abstract":"The thermal aspects are discussed of an immersion-cooled computer designed to operate at cryogenic temperatures. Several of the major thermal design issues are discussed in detail. These include: (1) the selection of a working fluid; (2) the determination of the mode, or modes, of heat transfer to be used: (3) the selection, or development, of any required heat transfer correlations; and (4) the selection of a refrigeration system. The results of a preliminary analysis of a candidate thermal control system are also presented.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"23","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.1988.28690","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 23
Abstract
The thermal aspects are discussed of an immersion-cooled computer designed to operate at cryogenic temperatures. Several of the major thermal design issues are discussed in detail. These include: (1) the selection of a working fluid; (2) the determination of the mode, or modes, of heat transfer to be used: (3) the selection, or development, of any required heat transfer correlations; and (4) the selection of a refrigeration system. The results of a preliminary analysis of a candidate thermal control system are also presented.<>
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