{"title":"The ALICE Pixel Sensor Upgrade","authors":"L. Lautner","doi":"10.22323/1.420.0026","DOIUrl":null,"url":null,"abstract":"The inner tracking system (ITS2) of the ALICE experiment is foreseen to be upgraded during the Long Shutdown 3 of the Large Hadron Collider (LHC). First data are expected to be taken during Run 4 with the upgraded High-Luminosity LHC. The planned ITS3 detector will be based on stitched, wafer-scale Monolithic Active Pixel Sensors (MAPS), bent to radii of 18, 24, and 30 mm and fabricated on 300 mm wafers in a 65 nm CMOS Imaging technology. They will be thinned down to below 50 µ m and held in place by carbon foam spacers, resulting in an unprecedented material budget of O(0.05%) 𝑋 / 𝑋 0 per layer. This contribution will present the detector concept, summarise the results of the R&D program, including most recent 65 nm prototypes, and provide an outlook on the path towards the final sensor development.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.22323/1.420.0026","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The inner tracking system (ITS2) of the ALICE experiment is foreseen to be upgraded during the Long Shutdown 3 of the Large Hadron Collider (LHC). First data are expected to be taken during Run 4 with the upgraded High-Luminosity LHC. The planned ITS3 detector will be based on stitched, wafer-scale Monolithic Active Pixel Sensors (MAPS), bent to radii of 18, 24, and 30 mm and fabricated on 300 mm wafers in a 65 nm CMOS Imaging technology. They will be thinned down to below 50 µ m and held in place by carbon foam spacers, resulting in an unprecedented material budget of O(0.05%) 𝑋 / 𝑋 0 per layer. This contribution will present the detector concept, summarise the results of the R&D program, including most recent 65 nm prototypes, and provide an outlook on the path towards the final sensor development.
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ALICE像素传感器升级
ALICE实验的内部跟踪系统(ITS2)预计将在大型强子对撞机(LHC)长时间关闭期间进行升级。第一批数据预计将在运行4期间使用升级后的高亮度LHC进行采集。计划中的ITS3探测器将基于缝合的晶圆级单片有源像素传感器(MAPS),弯曲成18、24和30毫米的半径,并在300毫米晶圆上采用65纳米CMOS成像技术制造。它们将被减薄至50微米以下,并由碳泡沫垫片固定,每层的材料预算为0(0.05%)𝑋/𝑋。这篇文章将介绍探测器的概念,总结研发计划的结果,包括最近的65纳米原型,并对最终传感器的发展道路进行展望。
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