The Impact of Tin Whisker Formation on Vehicle Electronics

Michelle L. Kuykendal, D. Kingsley, A. Arora
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Abstract

Tin whiskers are small, hair-like structures that can form naturally from the surface of tin components. While the mechanisms by which tin whiskers form are poorly understood, their potential effects are well documented: they can cause short circuits and arcs within electrical devices, damage micro-electromechanical systems (MEMS), and interfere with the operation of optical and RF components. As automotive systems become increasingly reliant on integrated electronics, the potential for reduced functionality or damage resulting from tin whisker formation increases; however, because the factors that contribute to whisker growth are still debated, design practices, testing standards, and mitigation processes to address tin whiskers have not matured. We discuss potential contributors to tin whisker growth, failure mechanisms that may be induced by whiskers, current testing standards and processes, and mitigation strategies, with a particular focus on the automotive industry.
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锡晶须形成对汽车电子的影响
锡晶须是微小的、毛发状的结构,可以从锡组件的表面自然形成。虽然锡晶须形成的机制尚不清楚,但它们的潜在影响已被充分记录:它们可能导致电气设备内的短路和电弧,损坏微机电系统(MEMS),并干扰光学和射频组件的操作。随着汽车系统越来越依赖集成电子,锡晶须形成导致功能降低或损坏的可能性增加;然而,由于导致晶须生长的因素仍存在争议,因此解决锡晶须的设计实践、测试标准和缓解过程尚未成熟。我们讨论了锡晶须生长的潜在因素、可能由晶须引起的失效机制、当前的测试标准和流程以及缓解策略,并特别关注汽车工业。
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