{"title":"The Impact of Tin Whisker Formation on Vehicle Electronics","authors":"Michelle L. Kuykendal, D. Kingsley, A. Arora","doi":"10.1109/ISPCE45810.2019.9248728","DOIUrl":null,"url":null,"abstract":"Tin whiskers are small, hair-like structures that can form naturally from the surface of tin components. While the mechanisms by which tin whiskers form are poorly understood, their potential effects are well documented: they can cause short circuits and arcs within electrical devices, damage micro-electromechanical systems (MEMS), and interfere with the operation of optical and RF components. As automotive systems become increasingly reliant on integrated electronics, the potential for reduced functionality or damage resulting from tin whisker formation increases; however, because the factors that contribute to whisker growth are still debated, design practices, testing standards, and mitigation processes to address tin whiskers have not matured. We discuss potential contributors to tin whisker growth, failure mechanisms that may be induced by whiskers, current testing standards and processes, and mitigation strategies, with a particular focus on the automotive industry.","PeriodicalId":374638,"journal":{"name":"2019 IEEE International Symposium on Product Compliance Engineering (ISPCE)","volume":"5 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE International Symposium on Product Compliance Engineering (ISPCE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPCE45810.2019.9248728","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Tin whiskers are small, hair-like structures that can form naturally from the surface of tin components. While the mechanisms by which tin whiskers form are poorly understood, their potential effects are well documented: they can cause short circuits and arcs within electrical devices, damage micro-electromechanical systems (MEMS), and interfere with the operation of optical and RF components. As automotive systems become increasingly reliant on integrated electronics, the potential for reduced functionality or damage resulting from tin whisker formation increases; however, because the factors that contribute to whisker growth are still debated, design practices, testing standards, and mitigation processes to address tin whiskers have not matured. We discuss potential contributors to tin whisker growth, failure mechanisms that may be induced by whiskers, current testing standards and processes, and mitigation strategies, with a particular focus on the automotive industry.