{"title":"Fabrication and dynamic testing of electrostatic actuators with p/sup +/ silicon diaphragms","authors":"E. Yang, S.S. Yang, S. Han, S.Y. Kim","doi":"10.1109/TENCON.1995.496327","DOIUrl":null,"url":null,"abstract":"This paper presents the fabrication and testing of electrostatic actuators. The p/sup +/ diaphragm is used as a moving electrode, whereas the aluminum layer deposited on a #7740 pyrex glass is used as a fixed electrode. The dynamic characteristics of the actuator with the corrugated diaphragm and that with the flat one are tested and compared with the calculation results, respectively.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TENCON.1995.496327","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents the fabrication and testing of electrostatic actuators. The p/sup +/ diaphragm is used as a moving electrode, whereas the aluminum layer deposited on a #7740 pyrex glass is used as a fixed electrode. The dynamic characteristics of the actuator with the corrugated diaphragm and that with the flat one are tested and compared with the calculation results, respectively.
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