FeFET based Logic-in-Memory: an overview

Cédric Marchand, I. O’Connor, Mayeul Cantan, E. Breyer, S. Slesazeck, T. Mikolajick
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引用次数: 6

Abstract

Emerging non-volatile memories are getting new interest in the system design community. They are used to design logic-in-memory circuits and propose alternatives to von-Neuman architectures. Hafnium oxide-based based ferroelectric memory technology, which is fully compatible with CMOS technologies is particularly interesting for logic-in-memory designs. Indeed, this compatibility leads to various possibilities for fine-grain logic in memory applications where the memory capable element is tightly integrated with the transistors in the system. Nonvolatile and energy efficient computing for Internet of things and embedded artificial intelligence are among the potential applications for this technology.In this article, we focus on ferroelectric field-effect transistors (FeFET) and present an overview of three different fine-grain logic-in-memory possibilities with FeFETs: custom operation designs, reconfigurable circuits and a hybrid memory element accessible by content or by address. All presented circuits have been designed within a test chip using 28nm technology provided by GLOBALFOUNDRIES.
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基于ffet的内存逻辑:概述
新兴的非易失性存储器在系统设计界引起了新的兴趣。它们被用来设计内存逻辑电路,并提出冯-诺伊曼架构的替代方案。基于氧化铪的铁电存储器技术与CMOS技术完全兼容,对于内存逻辑设计尤其有趣。事实上,这种兼容性为存储器应用中的细粒度逻辑提供了各种可能性,其中存储器功能元件与系统中的晶体管紧密集成。物联网和嵌入式人工智能的非易失性和节能计算是该技术的潜在应用之一。在本文中,我们关注铁电场效应晶体管(FeFET),并概述了使用FeFET的三种不同的细粒度内存逻辑可能性:自定义操作设计,可重构电路和可通过内容或地址访问的混合存储元件。所有展示的电路都是在使用GLOBALFOUNDRIES提供的28nm技术的测试芯片内设计的。
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