Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs

F. Ling, Kevin Cai, Bidyut Sen
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引用次数: 3

Abstract

Crosstalk analysis for high speed PCB design becomes more and more important due to the high data rate and tightly coupled routing. Traditional circuit-based analysis can not meet the accuracy demand. Three-dimensional (3D) full-wave electromagnetic solver is required to capture the complex 3D PCB environment and the frequency-dependent phenomena. However it is prohibitively expensive to simulate the practical large board cases and the resultant tabulated S-parameter cannot be directly used to quantify the crosstalk level. This paper introduces a novel hybrid solver techniques with improved speed and accuracy. The new crosstalk metrics to quantify the crosstalk level are also developed by post-processing S-parameter. Combining these two techniques allows designers to achieve full board crosstalk in a few hours as planned intended with using the tool, which significantly reduces the post-layout review time, allows layout optimization and ensures a timely sign-off.
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快速全板串扰扫描信号完整性签名高速PCB设计
高数据速率和紧密耦合布线使得串扰分析在高速PCB设计中变得越来越重要。传统的基于电路的分析已不能满足精度要求。三维(3D)全波电磁求解器需要捕获复杂的3D PCB环境和频率相关现象。然而,模拟实际的大型电路板情况是非常昂贵的,并且由此产生的表s参数不能直接用于量化串扰水平。本文介绍了一种新的混合求解技术,提高了求解速度和精度。通过对s参数的后处理,提出了量化串扰电平的新串扰指标。结合这两种技术,设计人员可以在几个小时内按照计划使用该工具实现全板串扰,这大大减少了布局后的审查时间,允许布局优化并确保及时签署。
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