Neural Network Modeling of Molecular Beam Epitaxy

Abstract

This paper presents the systematic characterization of the molecular beam epitaxy (MBE) process to quantitatively model the effects of process conditions on film qualities. A five-layer, undoped AlGaAs and InGaAs single quantum well structure grown on a GaAs substrate is designed and fabricated. Six input factors (time and temperature for oxide removal, substrate temperatures for AlGaAs and InGaAs layer growth, beam equivalent pressure of the As source and quantum well interrupt time) are examined by means of a fractional factorial experiment. Defect density, x-ray diffraction, and photoluminescence are characterized by a static response model developed by training back-propagation neural networks. In addition, two novel approaches for characterizing reflection high-energy electron diffraction (RHEED) signals used in the real-time monitoring of MBE are developed. In the first technique, principal component analysis is used to reduce the dimensionality of the RHEED data set, and the reduced RHEED data set is used to train neural nets to model the process responses. A second technique uses neural nets to model RHEED intensity signals as time series, and matches specific RHEED patterns to ambient process conditions. In each case, the neural process models exhibit good agreement with experimental results.