Hu Lu-jiang, Zhu Chang-chun, Huai Yong-Jing, Tie Zhiling, Li Yuming, Guo Cailing
{"title":"Research on the processing of vacuum microelectronic flat-panel displays","authors":"Hu Lu-jiang, Zhu Chang-chun, Huai Yong-Jing, Tie Zhiling, Li Yuming, Guo Cailing","doi":"10.1109/IVMC.1996.601890","DOIUrl":null,"url":null,"abstract":"The processing developed recently for vacuum microelectronic flat-panel nixies is described, including mainly how to fabricate the anode pillars (array) and the transparent flat-panel vacuum packages. Flat-panel nixies have been fabricated by the processing. The I-V characteristic between gates and cathodes was ideal. Field emission characteristic, accompanied by fluorescent light was also detected between cathodes and anodes. There are still some problems in maintaining the vacuum in package. The reasons are analyzed in the last part of the paper.","PeriodicalId":384104,"journal":{"name":"9th International Vacuum Microelectronics Conference","volume":"310 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"9th International Vacuum Microelectronics Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IVMC.1996.601890","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The processing developed recently for vacuum microelectronic flat-panel nixies is described, including mainly how to fabricate the anode pillars (array) and the transparent flat-panel vacuum packages. Flat-panel nixies have been fabricated by the processing. The I-V characteristic between gates and cathodes was ideal. Field emission characteristic, accompanied by fluorescent light was also detected between cathodes and anodes. There are still some problems in maintaining the vacuum in package. The reasons are analyzed in the last part of the paper.
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