{"title":"Organic packaging with integrated NFC for harsh environments","authors":"Sven Johannsen, E. Bihler, M. Hauer","doi":"10.1109/ESTC.2018.8546424","DOIUrl":null,"url":null,"abstract":"Liquid Crystal Polymer (LCP), a thermoplastic dielectric material with superior material properties can be used both as the substrate material and as the encapsulation for small miniaturized electronic packages and modules. Very small form factors can be obtained by integrating the NFC coil into the LCP substrate. Encapsulation in LCP can provide hermetically sealed and chemically inert miniaturized electronic modules for sensors applications in medical, industrial and automotive markets.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"369 5","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 7th Electronic System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2018.8546424","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Liquid Crystal Polymer (LCP), a thermoplastic dielectric material with superior material properties can be used both as the substrate material and as the encapsulation for small miniaturized electronic packages and modules. Very small form factors can be obtained by integrating the NFC coil into the LCP substrate. Encapsulation in LCP can provide hermetically sealed and chemically inert miniaturized electronic modules for sensors applications in medical, industrial and automotive markets.
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