Investigation on the Impact of Various Intercalation Doping on the Signal Integrity in ML-GNR Interconnects

Abstract

In this work, we perform a comparative study of signal integrity (delay, noise and noise delay product) for three different intercalation doped, side contact (SC), Multi-Layer Graphene Nano-Ribbon (ML-GNR) interconnects. For the first time, crosstalk delay of Lithium (Li) intercalated ML-GNR is evaluated and compared with Arsenic Penta-Fluoride (AsF5) doped, Ferric Chloride (FeCl3) doped ML-GNRs and copper interconnects for both intermediate and global level interconnects at 8 nm technology node. It is observed that Li intercalated ML-GNRs have least crosstalk delay as compared to other intercalation doping with specularity index of (P=0.8) for both intermediate and global level interconnects. As far as noise is considered, Li, FeCl3 and AsF5 doped ML-GNR interconnects are comparable but copper interconnects is not a good recommendation for low noise applications. Therefore, our analytical report paves the way for Li intercalated ML-GNR as the next generation interconnect material for low delay applications.