Yao-Jen Chang, Cheng-Ta Ko, Z. Hsiao, Ting-Yang Yu, Y. -. Chen, W. Lo, Kuan-Neng Chen
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引用次数: 3
Abstract
A wafer-level 3D integration structure with Cu TSVs based on Cu/Sn micro-bumps and BCB hybrid bonding is demonstrated. Kelvin structure and daisy chain design are adopted for electrical characterization and reliability evaluation. The results indicate the developed 3D integration scheme has excellent reliability and electrical stability.
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