Millimeter-wave microstrip integrated circuit transceiver packaging

Abstract

There has been considerable progress 1n the development of millimeter-wave hybrid integrated circuits. In program applications where low-cost and high-volume producibility are the key factors, planar microstrip technology 1s the preferred approach. The design and packaging of three fully integrated microstrip FMCW transceivers operating at 35, 60, and 94 GHz are discussed, plus a discussion on a unique low-cost, low-mass packaging approach for millimeter-wave microstrip based systems.