Silicon Debug and DFT for SOC IP

N. Dakwala
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Abstract

Nanometer circuits and fabrication process both are becoming increasingly complex at the same time. The very nature of silicon defects continue to evolve with these ground shift and are now focused on timing, signal integrity and process variations [1]. It is not enough to simply have full scan ATPG vectors. There will be diagnostics built into the ATPG tools to fall back on when the ATPG tests fail, but these don't help debug timing defects and when the fail test data is compressed [2]. When yields fall and there is a danger to miss the TTM, TTP, TTx windows, the SOC integrator must be ready for quick debug. Silicon Debug has evolved to be a process that requires planning, tools, and engineering resources. The basic DFT principles of controllability and observability need to be extended to isolate a failing IP. Last but not the least, both SOC IP provider and integrator need to support diagnostics or Failure Analysis to zero-in on a defect. Nanometer fails require a paradigm shift, from Design ¿ for-Test to Design-for-Debug. This tutorial will help the attendees recognize, enjoin and improve the Debug paradigm.
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SOC IP的硅调试和DFT
纳米电路和制造工艺同时变得越来越复杂。硅缺陷的本质随着这些地移而不断发展,现在主要集中在时序、信号完整性和工艺变化[1]。仅仅有全扫描ATPG矢量是不够的。当ATPG测试失败时,会有内置的ATPG工具进行诊断,但是当失败的测试数据被压缩时,这些工具并不能帮助调试定时缺陷[2]。当产量下降并且有错过TTM, TTP, TTx窗口的危险时,SOC集成商必须准备好进行快速调试。硅调试已经发展成为一个需要计划、工具和工程资源的过程。需要扩展DFT的可控性和可观察性的基本原理,以隔离故障IP。最后但并非最不重要的一点是,SOC IP提供商和集成商都需要支持诊断或故障分析来定位缺陷。纳米级的失败需要范式转变,从为测试而设计到为调试而设计。本教程将帮助与会者认识、指导和改进调试范例。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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