High Performance PIN Diode in 0.18-μm SiGe BiCMOS Process for Broadband Monolithic Control Circuits

P. Sun, P. Upadhyaya, Le Wang, DongHo Jeong, D. Heo
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引用次数: 10

Abstract

This paper presents a novel high isolation and low insertion loss broadband PIN diode implemented in a standard 0.18 μm SiGe BiCMOS process for upper X-band and lower Ku band LEO satellite phased array communication systems. By optimizing distance between anode and cathode terminals, the PIN diode overcomes the limitation of the common SiGe process which do not have customized etching step to remove the N-epi layer to build a high performance vertical PIN diode. Measurement shows that the PIN diodes achieve less than 1.09 dB insertion loss and isolation between 39dB to 13.67dB over DC to 18 GHz frequency. The PIN diode performance shows great potential for development of high performance MMICs in the standard SiGe processes
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用于宽带单片控制电路的0.18 μm SiGe BiCMOS工艺的高性能PIN二极管
本文提出了一种新型的高隔离、低插入损耗宽带PIN二极管,采用标准的0.18 μm SiGe BiCMOS工艺实现,用于上x波段和下Ku波段LEO卫星相控阵通信系统。通过优化阳极和阴极之间的距离,该PIN二极管克服了普通SiGe工艺没有定制蚀刻步骤来去除N-epi层的限制,从而构建了高性能的垂直PIN二极管。测量结果表明,在直流至18 GHz频率范围内,PIN二极管的插入损耗小于1.09 dB,隔离度在39dB至13.67dB之间。PIN二极管的性能显示了在标准SiGe工艺中开发高性能mmic的巨大潜力
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