A.E. Geissberger, R. Sadler, H. Singh, G. Lewis, I. Bahl, M. Balzan
{"title":"A monolithic L-band limiting amplifier and dual-modulus prescaler GaAs integrated circuit","authors":"A.E. Geissberger, R. Sadler, H. Singh, G. Lewis, I. Bahl, M. Balzan","doi":"10.1109/MWSYM.1988.22099","DOIUrl":null,"url":null,"abstract":"Fabrication details, radio-frequency (RF) yield results, and RF performance vs. temperature results are presented for an emitter-coupled-logic (ECL)-compatible L-band, limiting dual-modulus (/10/11) prescaler. This process for monolithic integration of analog and digital circuit functions uses refractory-self-aligned-gate FET technology. When tested with -22 dBm input signal power, one lot of six wafers had a total RF chip yield of 19%, with a best-wafer yield of 43%. The average operating frequency was 1.45 GHz (standard deviation (SD)=51 MHz) with an average power dissipation of 696 mW (SD=23 mW).<<ETX>>","PeriodicalId":339513,"journal":{"name":"1988., IEEE MTT-S International Microwave Symposium Digest","volume":"118 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1988., IEEE MTT-S International Microwave Symposium Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.1988.22099","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
Fabrication details, radio-frequency (RF) yield results, and RF performance vs. temperature results are presented for an emitter-coupled-logic (ECL)-compatible L-band, limiting dual-modulus (/10/11) prescaler. This process for monolithic integration of analog and digital circuit functions uses refractory-self-aligned-gate FET technology. When tested with -22 dBm input signal power, one lot of six wafers had a total RF chip yield of 19%, with a best-wafer yield of 43%. The average operating frequency was 1.45 GHz (standard deviation (SD)=51 MHz) with an average power dissipation of 696 mW (SD=23 mW).<>