Molecular Dynamics Simulation on Deformation Mechanism of Chemical Mechanical Polishing

Abstract

This study uses molecular dynamics (MD) simulation to examine how the sliding movement of a polishing tool affects the polishing properties of a Carbon-doped Boron Nitride substrate by discussing the effects of various polishing levels. The findings demonstrate how depth influences the amount of deleted atoms and severely extended asperity. The tool provides the most force at a depth of 6Å, whereas the polishing depth of 2Å produces the lowest polishing force. Hence, as polishing depth increases, the friction coefficient also increases. Moreover, the amount of deleted atoms and the extended asperity section increase with increased polishing depth while the asperity height decreases. Interestingly, this model also accurately depicts the behaviors of the material removal mechanism and the topography of the sample of the deleted atom chains after polishing.