TiO2:Nb film thickness influences on the amorphous InGaZnO thin film transistors with Mo/TiO2:Nb source-drain electrodes

Q.P. Lin, Bao-zhu Chang, Letao Zhang, Xiaoliang Zhou, Hongyu He, Shengdong Zhang
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Abstract

Various thicknesses (0, 5 and 70 nm) TiO2:Nb (TNO) films are used for the fabrication of amorphous InGaZnO (a-IGZO) thin film transistors (TFTs) with Mo/TNO source-drain (S-D) electrodes. All the as-prepared TFTs show similar electrical performance. However, the on-current of a-IGZO TFT with Mo/TNO(5 nm) S-D electrodes decreases dramatically after 300 °C annealing due to the large S-D parasitic resistance. In contrast, the S-D contact remain low for Mo/TNO(70 nm) S-D electrodes by 300 °C annealing.
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TiO2:Nb膜厚度对Mo/TiO2:Nb源漏极InGaZnO非晶薄膜晶体管的影响
采用不同厚度(0、5和70 nm)的TiO2:Nb (TNO)薄膜,制备了Mo/TNO源漏极(S-D)非晶InGaZnO (a-IGZO)薄膜晶体管(TFTs)。所有制备的tft均表现出相似的电学性能。然而,Mo/TNO(5 nm) S-D电极的a-IGZO TFT在300℃退火后,由于S-D寄生电阻大,导通电流急剧下降。相比之下,Mo/TNO(70 nm) S-D电极在300℃退火后,S-D接触仍然很低。
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