Chia-Tsen Dai, M. Ker, Yeh-Ning Jou, Shao-Chang Huang, Geeng-Lih Lin, Jian-Hsing Lee
{"title":"Study on Latchup Path between HV-LDMOS and LV-CMOS in a 0.16-μm 30-V/1.8-V BCD Technology","authors":"Chia-Tsen Dai, M. Ker, Yeh-Ning Jou, Shao-Chang Huang, Geeng-Lih Lin, Jian-Hsing Lee","doi":"10.23919/EOS/ESD.2018.8509772","DOIUrl":null,"url":null,"abstract":"The latchup path between high-voltage (HV) PMOS and low-voltage (LV) PMOS in a 0.16-μm 30-V/1.8-V bipolar-CMOS-DMOS (BCD) technology is studied. From the experiment results on silicon chip, this path can be easily induced into latchup state during the current-trigger latchup test. Therefore, the related layout rules should be carefully specified to avoid such HV-to-LV cross-domain latchup issue.","PeriodicalId":328499,"journal":{"name":"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EOS/ESD.2018.8509772","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The latchup path between high-voltage (HV) PMOS and low-voltage (LV) PMOS in a 0.16-μm 30-V/1.8-V bipolar-CMOS-DMOS (BCD) technology is studied. From the experiment results on silicon chip, this path can be easily induced into latchup state during the current-trigger latchup test. Therefore, the related layout rules should be carefully specified to avoid such HV-to-LV cross-domain latchup issue.