About Thermal Modes of Series-Connected Power Mosfets

N. Bespalov, A. Lysenkov
{"title":"About Thermal Modes of Series-Connected Power Mosfets","authors":"N. Bespalov, A. Lysenkov","doi":"10.1109/APEDE.2018.8542261","DOIUrl":null,"url":null,"abstract":"The choice of a power MOSFET is associated with a search for a compromise between the desire for high reliability of the final device and the desire to make maximum use of its power capabilities. The article deals with the problems of thermal calculations of series-connected power MOSFETs. The method for calculating the temperature mode of the transistor is described. The results of modeling the influence of the technological variability of the electrothermal parameters on the temperature distribution over the connected devices are presented.","PeriodicalId":311577,"journal":{"name":"2018 International Conference on Actual Problems of Electron Devices Engineering (APEDE)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Conference on Actual Problems of Electron Devices Engineering (APEDE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEDE.2018.8542261","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The choice of a power MOSFET is associated with a search for a compromise between the desire for high reliability of the final device and the desire to make maximum use of its power capabilities. The article deals with the problems of thermal calculations of series-connected power MOSFETs. The method for calculating the temperature mode of the transistor is described. The results of modeling the influence of the technological variability of the electrothermal parameters on the temperature distribution over the connected devices are presented.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
关于串联功率mosfet的热模式
功率MOSFET的选择与寻求最终器件高可靠性的愿望和最大限度地利用其功率能力的愿望之间的折衷有关。本文讨论了串联功率mosfet的热计算问题。描述了计算晶体管温度模态的方法。给出了电热参数的工艺变化对所连接器件温度分布影响的建模结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Investigation of Parameters of Rectangular Concentric Resonator Syntesis of the Quasi-Optimal Pitch Variation Law for the Helical TWT Microwave Method of Heat Treatment of Parabolic Antennas Non-Recombined Plasma Influence on the Neutron Pulse of the Gas-Filled Neutron Tube Study the Possibility of Optimizing Antenna Systems, for the Complex Landscape in LTE Networks
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1