Implementation of an in-situ particle monitoring methodology in a production environment

Y. Khawaja, S. Felker, T. Desanti
{"title":"Implementation of an in-situ particle monitoring methodology in a production environment","authors":"Y. Khawaja, S. Felker, T. Desanti","doi":"10.1109/ASMC.1996.558021","DOIUrl":null,"url":null,"abstract":"The time and logistics associated with particle testing on product have driven manufacturing to find fast and effective monitoring techniques that can deliver high manufacturing efficiency at a lower cost. In-situ particle monitoring is an accurate and cost effective method of contamination control in a production environment. In-situ particle monitors use laser particle counters to sample particles exiting the chamber, the data is displayed in real-time enabling the user to respond immediately to any out of control conditions. Implementation of in-situ particle monitoring on a chemical downstream etch system in a production environment is described. The chamber clean cycles on this etch system are driven by polymer flaking from chamber parts, which makes real time particulate monitoring necessary. In-situ plasma clean process is characterized using in-situ particle monitors to reduce particulate flaking from chamber parts. All process steps during the etch step are also analyzed using in-situ monitors to identify and eliminate sources of particulate contamination. Implementation of in-situ monitoring resulted in a 92% reduction in test wafer costs, and also provided a model for predicting particulate perturbations in the etch system. Improvements in cleaning techniques resulted in a two fold improvement in the mean time between cleans.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1996.558021","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The time and logistics associated with particle testing on product have driven manufacturing to find fast and effective monitoring techniques that can deliver high manufacturing efficiency at a lower cost. In-situ particle monitoring is an accurate and cost effective method of contamination control in a production environment. In-situ particle monitors use laser particle counters to sample particles exiting the chamber, the data is displayed in real-time enabling the user to respond immediately to any out of control conditions. Implementation of in-situ particle monitoring on a chemical downstream etch system in a production environment is described. The chamber clean cycles on this etch system are driven by polymer flaking from chamber parts, which makes real time particulate monitoring necessary. In-situ plasma clean process is characterized using in-situ particle monitors to reduce particulate flaking from chamber parts. All process steps during the etch step are also analyzed using in-situ monitors to identify and eliminate sources of particulate contamination. Implementation of in-situ monitoring resulted in a 92% reduction in test wafer costs, and also provided a model for predicting particulate perturbations in the etch system. Improvements in cleaning techniques resulted in a two fold improvement in the mean time between cleans.
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在生产环境中实施现场颗粒监测方法
与产品颗粒测试相关的时间和物流促使制造商寻找快速有效的监控技术,以更低的成本提供更高的制造效率。在生产环境中,现场颗粒监测是一种准确且经济有效的污染控制方法。现场颗粒监测器使用激光颗粒计数器对离开腔室的颗粒进行采样,数据实时显示,使用户能够立即响应任何失控情况。介绍了在生产环境中对化工下游蚀刻系统进行现场颗粒监测的实施情况。该蚀刻系统的腔室清洁周期由腔室部件的聚合物剥落驱动,这使得实时颗粒监测成为必要。采用原位颗粒监测仪对原位等离子体清洁过程进行了表征,以减少腔室部件的颗粒剥落。蚀刻过程中的所有工艺步骤也使用现场监视器进行分析,以识别和消除颗粒污染源。现场监测的实施使测试晶圆成本降低了92%,并且还提供了预测蚀刻系统中颗粒扰动的模型。清洁技术的改进使两次清洁之间的平均时间缩短了两倍。
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