{"title":"Hygrothermal reliability evaluation of plastic IC packages with computer-aided engineering tools","authors":"A. Kuo, L. Nguyen","doi":"10.1109/PEP.1997.656486","DOIUrl":null,"url":null,"abstract":"This paper presents the development and application of a computer-aided engineering tool, EPACK(TM), for hygro-thermal-mechanical performance and reliability evaluation of plastic IC packages. With this user-friendly and fully automated tool, a packaging engineer can perform reliability evaluation of a plastic IC package in minutes.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"147 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PEP.1997.656486","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
This paper presents the development and application of a computer-aided engineering tool, EPACK(TM), for hygro-thermal-mechanical performance and reliability evaluation of plastic IC packages. With this user-friendly and fully automated tool, a packaging engineer can perform reliability evaluation of a plastic IC package in minutes.
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