A novel Micro-CT data based Finite Element Modeling technique to study reliability of densely packed fuze assemblies

P. Lall, Nakul Kothari, J. Foley, John Deep, Ryan Lowe
{"title":"A novel Micro-CT data based Finite Element Modeling technique to study reliability of densely packed fuze assemblies","authors":"P. Lall, Nakul Kothari, J. Foley, John Deep, Ryan Lowe","doi":"10.1109/ITHERM.2016.7517584","DOIUrl":null,"url":null,"abstract":"Densely packed electrical assemblies like fuze, contain large number of components, potted in protective adhesives. The number of components, varying material types, irregular geometry of the components and the geometric details of the assembly makes conventional CAD modeling, meshing and Finite Element(FE) modeling of these large assemblies extremely time consuming, often, to the extent of being impractical. CAD geometries compatible with modern Finite Element (FE) platforms may not be available for several legacy systems. Furthermore, conventional CAD modeling may not account for the real geometry realized after the manufacturing process and this can often affect the fidelity of the FE model. There is no method for capturing the actual assembly geometry and its embedded components. Assessment of survivability of fuzes requires assessment of stresses and strains under operational loads. Previously, researchers have studied the reliability of key components in a fuze device subjected to high temperature and high g mechanical shocks [1]. Researchers have measured redundancy and reliability of fuze electronics using failure rates and mean time to failure as per MIL-HDBK-217F standard [2]. There is little to no literature on FE modeling of a comprehensive fuze assembly. In this paper, a methodology for the creation of an FE model based on Micro-CT (Computed Tomography) data is presented. The method has been applied to an actual fuze subjected to mechanical shock. This method involves usage of advanced 3D imaging, image segmentation, image filtering and meshing techniques to directly convert CT scanned electrical assemblies into a FE mesh. This method successfully bypasses the time consuming CAD modeling step of conventional FE modeling. The as-is geometry of each component, positioned accurately in a 3D space, as per the original assembly, has been realized in this process by usage of micro-CT scanning technique. The submicron scale tolerances of the CT scanned data ensure true representation of the fuze assembly, in this case. The FE model thus realized, allows for measurement of all the field variables, anywhere over its meshed domain. Stress and strain histories have been extracted for embedded components of the fuze assembly using explicit finite element models.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2016.7517584","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

Densely packed electrical assemblies like fuze, contain large number of components, potted in protective adhesives. The number of components, varying material types, irregular geometry of the components and the geometric details of the assembly makes conventional CAD modeling, meshing and Finite Element(FE) modeling of these large assemblies extremely time consuming, often, to the extent of being impractical. CAD geometries compatible with modern Finite Element (FE) platforms may not be available for several legacy systems. Furthermore, conventional CAD modeling may not account for the real geometry realized after the manufacturing process and this can often affect the fidelity of the FE model. There is no method for capturing the actual assembly geometry and its embedded components. Assessment of survivability of fuzes requires assessment of stresses and strains under operational loads. Previously, researchers have studied the reliability of key components in a fuze device subjected to high temperature and high g mechanical shocks [1]. Researchers have measured redundancy and reliability of fuze electronics using failure rates and mean time to failure as per MIL-HDBK-217F standard [2]. There is little to no literature on FE modeling of a comprehensive fuze assembly. In this paper, a methodology for the creation of an FE model based on Micro-CT (Computed Tomography) data is presented. The method has been applied to an actual fuze subjected to mechanical shock. This method involves usage of advanced 3D imaging, image segmentation, image filtering and meshing techniques to directly convert CT scanned electrical assemblies into a FE mesh. This method successfully bypasses the time consuming CAD modeling step of conventional FE modeling. The as-is geometry of each component, positioned accurately in a 3D space, as per the original assembly, has been realized in this process by usage of micro-CT scanning technique. The submicron scale tolerances of the CT scanned data ensure true representation of the fuze assembly, in this case. The FE model thus realized, allows for measurement of all the field variables, anywhere over its meshed domain. Stress and strain histories have been extracted for embedded components of the fuze assembly using explicit finite element models.
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一种新的基于微ct数据的有限元建模技术来研究密装引信组件的可靠性
密密麻麻的电气组件,如引信,包含大量的组件,密封在保护粘合剂中。组件的数量、不同的材料类型、组件的不规则几何形状和组件的几何细节使得这些大型组件的传统CAD建模、网格划分和有限元(FE)建模非常耗时,而且往往达到不切实际的程度。与现代有限元(FE)平台兼容的CAD几何图形可能不适用于一些遗留系统。此外,传统的CAD建模可能无法考虑到制造过程后实现的真实几何形状,这通常会影响有限元模型的保真度。没有捕获实际装配几何形状及其嵌入组件的方法。评估引信的生存能力需要评估在工作载荷下的应力和应变。此前,有研究人员对引信装置关键部件在高温高g机械冲击下的可靠性进行了研究[1]。研究人员根据MIL-HDBK-217F标准[2],使用故障率和平均故障时间来测量引信电子设备的冗余和可靠性。关于综合引信组件的有限元建模的文献很少甚至没有。本文提出了一种基于微ct(计算机断层扫描)数据建立有限元模型的方法。该方法已应用于实际的机械冲击引信。该方法涉及使用先进的3D成像、图像分割、图像滤波和网格划分技术,直接将CT扫描的电气组件转换为FE网格。该方法成功地绕过了传统有限元建模中耗时的CAD建模步骤。在这个过程中,利用micro-CT扫描技术,实现了每个部件的原样几何形状在三维空间中的精确定位。在这种情况下,CT扫描数据的亚微米尺度公差确保了引信组件的真实表示。因此实现的有限元模型,允许测量所有的场变量,在其网格域的任何地方。利用显式有限元模型提取了引信组件内嵌构件的应力和应变历史。
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