Reliability aspects of electronics packaging technology using conductive adhesives

Abstract

Conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last decades. It is time to make a summary of what has been done in this field. The present paper reviews the technology development, especially from the reliability point of view. It is pointed that conductive adhesives are now widely used in many applications and the reliability data and models have been developed to a large extent for conductive adhesives in various applications.