Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596522
A. Bondar, A. Bara, D. Pătroi, P. Svasta
Carbon nanotubes (CNT) have attracted much attention from the researches worldwide, because they show superior physical and electrical potentials, which allow them to be applied in a large field of technologies. In recent years, studies into the practical applications of CNT have focused on polymeric composite for electronic packaging. This paper present the results of our researches for obtaining of conductive pastes based on carbon mesophase/carbon nanotubes nanocomposites like functional filler in a polymeric matrix. The nanocomposites were obtained by adding of single walled carbon nanotubes (SWNT) or multi walled carbon nanotubes (MWNT) in a petroleum pitch. It was reported that SWNT behave as either a metal or a semiconductor depending on the wrapping angle of the graphene sheet and its diameter, while MWNT are always conductive. Carbonic functional phase, obtained by heat treatment of pitch/nanotubes mixtures at 900°C temperatures, was structural characterized by optical microscopy, SEM, X-ray Diffraction and functional by electrical resistivity measurements. Polymeric composites were obtained by adding carbonic functional phase in an epoxy resin matrix. These were characterized to establish the electrical percolation threshold.
{"title":"Carbon Mesophase/Carbon Nanotubes Nanocomposite - Functional Filler for Conductive Pastes","authors":"A. Bondar, A. Bara, D. Pătroi, P. Svasta","doi":"10.1109/POLYTR.2005.1596522","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596522","url":null,"abstract":"Carbon nanotubes (CNT) have attracted much attention from the researches worldwide, because they show superior physical and electrical potentials, which allow them to be applied in a large field of technologies. In recent years, studies into the practical applications of CNT have focused on polymeric composite for electronic packaging. This paper present the results of our researches for obtaining of conductive pastes based on carbon mesophase/carbon nanotubes nanocomposites like functional filler in a polymeric matrix. The nanocomposites were obtained by adding of single walled carbon nanotubes (SWNT) or multi walled carbon nanotubes (MWNT) in a petroleum pitch. It was reported that SWNT behave as either a metal or a semiconductor depending on the wrapping angle of the graphene sheet and its diameter, while MWNT are always conductive. Carbonic functional phase, obtained by heat treatment of pitch/nanotubes mixtures at 900°C temperatures, was structural characterized by optical microscopy, SEM, X-ray Diffraction and functional by electrical resistivity measurements. Polymeric composites were obtained by adding carbonic functional phase in an epoxy resin matrix. These were characterized to establish the electrical percolation threshold.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121233630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596520
R. Berenyi, Z. Illyefalvi-Vitéz
In microelectronics industry the main driving forces are to improve performance and to lower cost. From the performance point of view the small distances between chips together with the short interconnection routes have of great importance in order to achieve faster operation. The application of polymeric materials for the insulating and protective layers of interconnect substrates is beneficial to the performance and to the cost of a circuit module as well [1-2]. An advanced technology for the fabrication of very high density interconnects applies multi-folded 3D (three-dimensional) microvia flexible substrates, where laser via and bending window generation technology has particular significance [3]. Bending window generation is a unique application of laser material processing. A bending window can be used in a flexible circuit to define the exact position of the bending edge as well as the radius and the angle of the deformation. It is produced by reducing the thickness of the flexible substrate in a well-defined, narrow window. The paper gives an overview on laser processing of flexible polymer materials to produce bending windows for multi-folded 3D substrates.
{"title":"Laser Manufacturing of Mechanical Structures in Flexible Substrates","authors":"R. Berenyi, Z. Illyefalvi-Vitéz","doi":"10.1109/POLYTR.2005.1596520","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596520","url":null,"abstract":"In microelectronics industry the main driving forces are to improve performance and to lower cost. From the performance point of view the small distances between chips together with the short interconnection routes have of great importance in order to achieve faster operation. The application of polymeric materials for the insulating and protective layers of interconnect substrates is beneficial to the performance and to the cost of a circuit module as well [1-2]. An advanced technology for the fabrication of very high density interconnects applies multi-folded 3D (three-dimensional) microvia flexible substrates, where laser via and bending window generation technology has particular significance [3]. Bending window generation is a unique application of laser material processing. A bending window can be used in a flexible circuit to define the exact position of the bending edge as well as the radius and the angle of the deformation. It is produced by reducing the thickness of the flexible substrate in a well-defined, narrow window. The paper gives an overview on laser processing of flexible polymer materials to produce bending windows for multi-folded 3D substrates.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122854942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596517
J. Borecki, J. Felba, W. Posadowski
At last years the extreme demand on miniaturized, functional and also more and more reliable electronic equipment is observed. The development of electronic industry strongly depends on scale of electronic components miniaturization but also depends on miniaturization and kind of printed circuit boards (PCBs). The high level of integration of electronic components, such as Chip Size Packages (CSPs) or micro scale Ball Grid Arrays (μBGAs) determines the designers of electronic devices to create modern layouts. The using of appropriate materials on PCBs and using of newest techniques of manufacture creates the new possibilities of electronics application. At present, the polymers plays more and more important role in electronics, especially in flexible electronics. The big challenge is manufacture of connections and interconnections in polymer PCBs. In the paper the idea of interconnections metallization by using of magnetron sputtering deposition of copper is presented. Such process permits to metallize of interconnections based on microvias with high aspect ratio (deep/diameter) even about 5:1. The realized investigations show that the mentioned technology is the big success in domain of techniques of interconnections metallization and it is very promising for High Tech PCBs manufacturers.
{"title":"Magnetron Sputtering Deposition of Copper on Polymers in High Density Interconnection PCB's","authors":"J. Borecki, J. Felba, W. Posadowski","doi":"10.1109/POLYTR.2005.1596517","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596517","url":null,"abstract":"At last years the extreme demand on miniaturized, functional and also more and more reliable electronic equipment is observed. The development of electronic industry strongly depends on scale of electronic components miniaturization but also depends on miniaturization and kind of printed circuit boards (PCBs). The high level of integration of electronic components, such as Chip Size Packages (CSPs) or micro scale Ball Grid Arrays (μBGAs) determines the designers of electronic devices to create modern layouts. The using of appropriate materials on PCBs and using of newest techniques of manufacture creates the new possibilities of electronics application. At present, the polymers plays more and more important role in electronics, especially in flexible electronics. The big challenge is manufacture of connections and interconnections in polymer PCBs. In the paper the idea of interconnections metallization by using of magnetron sputtering deposition of copper is presented. Such process permits to metallize of interconnections based on microvias with high aspect ratio (deep/diameter) even about 5:1. The realized investigations show that the mentioned technology is the big success in domain of techniques of interconnections metallization and it is very promising for High Tech PCBs manufacturers.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128426327","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596489
H. Kempa, K. Reuter, M. Bartzsch, U. Hahn, A. Huebler, D. Zielke, M. Forster, U. Scherf
We report on a systematic study on the stability of organic field effect transistors built solely from materials which can be utilised in conventional, highly productive mass-printing methods. We compare devices based on two polymer semiconductors that show good performance in transistors: poly(9,9-dioctylfluorene-co-bithiophene), a commercially available material, and poly(triphenylamine), a material especially designed for high stability. We performed tests of the evolution of the important transistor properties under ambient storage conditions, under the influence of elevated and low temperatures, under illumination with UV-light and under operation of the devices. We find a significantly improved stability of the devices based on poly(triphenylamine) in all of the experiments and comment on the relevance of the stability issues for prospected applications.
{"title":"Stability study of all-polymer field-effect transistors","authors":"H. Kempa, K. Reuter, M. Bartzsch, U. Hahn, A. Huebler, D. Zielke, M. Forster, U. Scherf","doi":"10.1109/POLYTR.2005.1596489","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596489","url":null,"abstract":"We report on a systematic study on the stability of organic field effect transistors built solely from materials which can be utilised in conventional, highly productive mass-printing methods. We compare devices based on two polymer semiconductors that show good performance in transistors: poly(9,9-dioctylfluorene-co-bithiophene), a commercially available material, and poly(triphenylamine), a material especially designed for high stability. We performed tests of the evolution of the important transistor properties under ambient storage conditions, under the influence of elevated and low temperatures, under illumination with UV-light and under operation of the devices. We find a significantly improved stability of the devices based on poly(triphenylamine) in all of the experiments and comment on the relevance of the stability issues for prospected applications.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126456638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596494
M. Inoue, Y. Yamasaki, K. Suganuma, T. Kawasaki, T. Rokuhara, T. Miyashita, H. Ishiguro
The super-flexible wires, which can withstand significant stretch as well as bend, are successfully developed by using the conductive adhesive containing Ag particles dispersed in a silicone-based binder. After curing under suitable conditions, the electrical conduction in the adhesive was detectable until the elongation reached to 100-180 %. Furthermore, the electric resistance was almost recovered after removing tensile stress. This wiring technology was applied for fabricating a prototype sensor sheet for artificial skin applications of robots and related equipments. The piezoelectric films composed of poly(vinylidene fluoride) were assembled on a silicone substrate by using the silicone-based conductive adhesive in order to fabricate the sensor sheet. The information related to pressure distribution was monitored successfully when we toughed the sensor sheet.
{"title":"Development of Super-Flexible Wires Using Conductive Adhesives for Artificial Skin Applications of Robots and Related Equipments","authors":"M. Inoue, Y. Yamasaki, K. Suganuma, T. Kawasaki, T. Rokuhara, T. Miyashita, H. Ishiguro","doi":"10.1109/POLYTR.2005.1596494","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596494","url":null,"abstract":"The super-flexible wires, which can withstand significant stretch as well as bend, are successfully developed by using the conductive adhesive containing Ag particles dispersed in a silicone-based binder. After curing under suitable conditions, the electrical conduction in the adhesive was detectable until the elongation reached to 100-180 %. Furthermore, the electric resistance was almost recovered after removing tensile stress. This wiring technology was applied for fabricating a prototype sensor sheet for artificial skin applications of robots and related equipments. The piezoelectric films composed of poly(vinylidene fluoride) were assembled on a silicone substrate by using the silicone-based conductive adhesive in order to fabricate the sensor sheet. The information related to pressure distribution was monitored successfully when we toughed the sensor sheet.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134370026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1002/9781118831373.CH5
J. Morris, Jeahuck Lee, J. Liu
This paper is intended to provide an initial resource for researchers and practitioners entering the isotropic conductive adhesive (ICA) field, but may also prove useful to those with prior experience. It presents an historical overview of the issues confronted in ICA development and use in various electronics packaging applications in place of soldering technology.
{"title":"Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications","authors":"J. Morris, Jeahuck Lee, J. Liu","doi":"10.1002/9781118831373.CH5","DOIUrl":"https://doi.org/10.1002/9781118831373.CH5","url":null,"abstract":"This paper is intended to provide an initial resource for researchers and practitioners entering the isotropic conductive adhesive (ICA) field, but may also prove useful to those with prior experience. It presents an historical overview of the issues confronted in ICA development and use in various electronics packaging applications in place of soldering technology.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116875218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596481
D.G. Yang, L. Ernst, K. Jansen, G.Q. Zhang, J. Janssen, H. Bressers
QFN package is getting rapid market acceptance because of its excellent thermal and electrical performance and its miniaturization and low cost. However, the warpage problem caused by molding process imposes a great concern for the manufacturing of the products. To investigate the effect of the EMC properties, package parameters and processing conditions on the warpage, experimental approach and numerical simulations were conducted on Philips business carrier HVQFN package. A series of molding experiments for QFN matrix strips with the model-molding compounds were performed. In the molding experiments, different processing parameters, filler loading and die thickness were used. The warpage was measured by a contact probe coordinate measuring system. In the finite simulations, a previously proposed cure-dependent constitutive model for the encapsulating EMC was applied to describe the behavior of the material during the curing process. The results show that both of the filler percentage and the die thickness has a significant effect on the final warpage level.
{"title":"Process-induced Warpage in HVQFN Package: Effect of Design Parameters and Processing Conditions","authors":"D.G. Yang, L. Ernst, K. Jansen, G.Q. Zhang, J. Janssen, H. Bressers","doi":"10.1109/POLYTR.2005.1596481","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596481","url":null,"abstract":"QFN package is getting rapid market acceptance because of its excellent thermal and electrical performance and its miniaturization and low cost. However, the warpage problem caused by molding process imposes a great concern for the manufacturing of the products. To investigate the effect of the EMC properties, package parameters and processing conditions on the warpage, experimental approach and numerical simulations were conducted on Philips business carrier HVQFN package. A series of molding experiments for QFN matrix strips with the model-molding compounds were performed. In the molding experiments, different processing parameters, filler loading and die thickness were used. The warpage was measured by a contact probe coordinate measuring system. In the finite simulations, a previously proposed cure-dependent constitutive model for the encapsulating EMC was applied to describe the behavior of the material during the curing process. The results show that both of the filler percentage and the die thickness has a significant effect on the final warpage level.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"123 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122158858","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596488
C. Pannemann, T. Diekmann, U. Hilleringmann, U. Schurmann, M. Scharnberg, V. Zaporojtchenko, R. Adelung, F. Faupel
Organic thin-film transistors (OTFTs) with W = 1000 μm and L = 1 μm were produced with a high batch reproducibility of the on-current of -63.3 μA +/- 17 μA (-40 VDS, - 40VGS) and the threshold voltage of 1.3 V +/- 1.44V. Unprotected organic devices suffer from degradation due to water damp and oxygen incorporation. To validate the function of an OTFT capsulation, interdigital transistor structures (W = 46.8cm, L = 20 μm) were prepared on p-type silicon wafers to drive a high current (initially -6.8 mA at -40 VDS, - 40VGS) in order to detect an explicit reaction to degradation. Subsequently, the OTFT's active layer was encapsulated with 1.5 μm of sputtered polytetrafluoroethylene (PTFE) driving a current of -6.2 mA. A degradation experiment over 4 months in dark laboratory conditions revealed a reduced degradation compared to earlier experiments. The threshold voltage shifted in positive direction suggesting degradation only from oxygen. Obviously, the degradation from humidity was blocked. Otherwise, it would have caused a negative threshold voltage shift.
{"title":"Encapsulating the active Layer of organic Thin-Film Transistors","authors":"C. Pannemann, T. Diekmann, U. Hilleringmann, U. Schurmann, M. Scharnberg, V. Zaporojtchenko, R. Adelung, F. Faupel","doi":"10.1109/POLYTR.2005.1596488","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596488","url":null,"abstract":"Organic thin-film transistors (OTFTs) with W = 1000 μm and L = 1 μm were produced with a high batch reproducibility of the on-current of -63.3 μA +/- 17 μA (-40 VDS, - 40VGS) and the threshold voltage of 1.3 V +/- 1.44V. Unprotected organic devices suffer from degradation due to water damp and oxygen incorporation. To validate the function of an OTFT capsulation, interdigital transistor structures (W = 46.8cm, L = 20 μm) were prepared on p-type silicon wafers to drive a high current (initially -6.8 mA at -40 VDS, - 40VGS) in order to detect an explicit reaction to degradation. Subsequently, the OTFT's active layer was encapsulated with 1.5 μm of sputtered polytetrafluoroethylene (PTFE) driving a current of -6.2 mA. A degradation experiment over 4 months in dark laboratory conditions revealed a reduced degradation compared to earlier experiments. The threshold voltage shifted in positive direction suggesting degradation only from oxygen. Obviously, the degradation from humidity was blocked. Otherwise, it would have caused a negative threshold voltage shift.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127521526","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596486
M. Hedges, M. Renn, M. Kardos
The continual drive for smaller, more powerful and economic electronic systems, has led to the development of a new manufacturing technology, Maskless Mesoscale Materials Deposition (M3D). Without masks or resists, features down to 10 microns can be directly written in a wide variety of materials, including metals, ceramics, polymers and adhesives, on virtually any surface material - silicon, glass, polymers, metals and ceramics. For polymer substrates with a low temperature tolerance, M3D locally processes the deposition through a laser scanning process. The end result is a high-quality thin film with excellent edge definition and near-bulk electronic properties. As a CAD driven, additive manufacturing process, M3D provides significant environmental benefits and reduced processing requirements, eliminating the waste associated with traditional subtractive (e.g. mask and etch) processes. M3D can also precisely deposit materials on non-planar substrates. With no physical contact with the substrate by any portion of the tool other than the deposition stream, conformal writing is easily achieved. Other benefits include: • Time Compression and Increased Manufacturing Agility, • Lower Costs and • Better Product Designs. This paper will detail the benefits of M3D technology in creating mesoscale features for electronics assembly and semiconductor packaging applications. It will outline some of the current application areas including polymer deposition for electronics.
{"title":"Mesoscale Deposition Technology for Electronics Applications","authors":"M. Hedges, M. Renn, M. Kardos","doi":"10.1109/POLYTR.2005.1596486","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596486","url":null,"abstract":"The continual drive for smaller, more powerful and economic electronic systems, has led to the development of a new manufacturing technology, Maskless Mesoscale Materials Deposition (M3D). Without masks or resists, features down to 10 microns can be directly written in a wide variety of materials, including metals, ceramics, polymers and adhesives, on virtually any surface material - silicon, glass, polymers, metals and ceramics. For polymer substrates with a low temperature tolerance, M3D locally processes the deposition through a laser scanning process. The end result is a high-quality thin film with excellent edge definition and near-bulk electronic properties. As a CAD driven, additive manufacturing process, M3D provides significant environmental benefits and reduced processing requirements, eliminating the waste associated with traditional subtractive (e.g. mask and etch) processes. M3D can also precisely deposit materials on non-planar substrates. With no physical contact with the substrate by any portion of the tool other than the deposition stream, conformal writing is easily achieved. Other benefits include: • Time Compression and Increased Manufacturing Agility, • Lower Costs and • Better Product Designs. This paper will detail the benefits of M3D technology in creating mesoscale features for electronics assembly and semiconductor packaging applications. It will outline some of the current application areas including polymer deposition for electronics.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"201 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130847882","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-10-23DOI: 10.1109/POLYTR.2005.1596483
L. Jianxiong, Chaw Chi Cheun, T. Kin, L. Deming, Kwan Yiu Fai
MPF resoles were synthesized with ammonia catalyst. The nitrogen content of the synthesized MPF resins was measured with Elemetar analyzer and the molecular structure was analyzed with FTIR. The effect of the MPF resoles as primer on the bonding of EMC to Cu, Ni, Ag, Pd or Au was investigated. The melamine moiety as well as the amine catalyst joined to the resoles, leading to higher nitrogen contents than the theoretical values based on the charging ratio of monomers. The introduced nitrogen gave remarkable contribution to the PF resole in adhesion promotion between EMC and LF metals. When the MPF resoles were applied on copper surface as primer, the shear strength increased with increasing nitrogen content till 12 %. Beyond this point the shear strength left off as the nitrogen content increased further. The shear strength would vary also as the concentration of the resole solutions changed. However, within the range from 0.4 % to 10 %, the shear strength could remain at levels above 6 MPa. Even under MSL I condition, the bonding of EMC to LF metals could be enhanced more than two times.
{"title":"Improving bonding of EMC to LF metals with melamine-phenol-formaldehyde resins","authors":"L. Jianxiong, Chaw Chi Cheun, T. Kin, L. Deming, Kwan Yiu Fai","doi":"10.1109/POLYTR.2005.1596483","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596483","url":null,"abstract":"MPF resoles were synthesized with ammonia catalyst. The nitrogen content of the synthesized MPF resins was measured with Elemetar analyzer and the molecular structure was analyzed with FTIR. The effect of the MPF resoles as primer on the bonding of EMC to Cu, Ni, Ag, Pd or Au was investigated. The melamine moiety as well as the amine catalyst joined to the resoles, leading to higher nitrogen contents than the theoretical values based on the charging ratio of monomers. The introduced nitrogen gave remarkable contribution to the PF resole in adhesion promotion between EMC and LF metals. When the MPF resoles were applied on copper surface as primer, the shear strength increased with increasing nitrogen content till 12 %. Beyond this point the shear strength left off as the nitrogen content increased further. The shear strength would vary also as the concentration of the resole solutions changed. However, within the range from 0.4 % to 10 %, the shear strength could remain at levels above 6 MPa. Even under MSL I condition, the bonding of EMC to LF metals could be enhanced more than two times.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126616995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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