4Gbit density STT-MRAM using perpendicular MTJ realized with compact cell structure

Sung-Woong Chung, T. Kishi, Jeongsoo Park, M. Yoshikawa, Kyoung-Hwan Park, T. Nagase, K. Sunouchi, H. Kanaya, G. Kim, K. Noma, Mun-Haeng Lee, A. Yamamoto, KwangMyoung Rho, K. Tsuchida, Suock Chung, J. Yi, Hyeongon Kim, Chun Yun-Seok, H. Oyamatsu, Sung-Kee Hong
{"title":"4Gbit density STT-MRAM using perpendicular MTJ realized with compact cell structure","authors":"Sung-Woong Chung, T. Kishi, Jeongsoo Park, M. Yoshikawa, Kyoung-Hwan Park, T. Nagase, K. Sunouchi, H. Kanaya, G. Kim, K. Noma, Mun-Haeng Lee, A. Yamamoto, KwangMyoung Rho, K. Tsuchida, Suock Chung, J. Yi, Hyeongon Kim, Chun Yun-Seok, H. Oyamatsu, Sung-Kee Hong","doi":"10.1109/IEDM.2016.7838490","DOIUrl":null,"url":null,"abstract":"For the first time, 4Gbit density STT-MRAM using perpendicular MTJ in compact cell was successfully demonstrated through the tight distributions for resistance and magnetic properties. This paper includes the results regarding parasitic resistance control process, MTJ process, and MTJ stack engineering. Both of successful 4Gb read and write operations were performed with high TMR, low Ic. This result will brighten the prospect of high-density STT-MRAM.","PeriodicalId":186544,"journal":{"name":"2016 IEEE International Electron Devices Meeting (IEDM)","volume":"187 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"111","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2016.7838490","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 111

Abstract

For the first time, 4Gbit density STT-MRAM using perpendicular MTJ in compact cell was successfully demonstrated through the tight distributions for resistance and magnetic properties. This paper includes the results regarding parasitic resistance control process, MTJ process, and MTJ stack engineering. Both of successful 4Gb read and write operations were performed with high TMR, low Ic. This result will brighten the prospect of high-density STT-MRAM.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
4Gbit密度STT-MRAM采用垂直MTJ实现,小区结构紧凑
首次成功地证明了垂直MTJ的4Gbit密度STT-MRAM在紧凑电池中的电阻和磁性能分布紧密。本文包括寄生电阻控制过程、MTJ过程和MTJ堆栈工程方面的研究成果。这两个成功的4Gb读写操作都是在高TMR、低Ic的条件下完成的,这一结果将照亮高密度STT-MRAM的前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
SOI technology for quantum information processing Sustainable electronics for nano-spacecraft in deep space missions Current status and challenges of the modeling of organic photodiodes and solar cells Triboelectric energy harvester with an ultra-thin tribo-dielectric layer by initiated CVD and investigation of underlying physics in the triboelectricity 256×256, 100kfps, 61% Fill-factor time-resolved SPAD image sensor for microscopy applications
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1