Assembly process for high bandwidth density organic optical MCM

Abstract

We develop a high-bandwidth density organic optical multi-chip module (MCM). A high packaging density is achieved by integrating bare optical chips, developing compact fiber connectors that connect perpendicularly to the surface of the module, and manufacturing total internal reflection mirrors by a precise laser ablation technique. An assembly procedure for the optical MCM is established. It is verified that the organic MCM is resistant to heat of reflow processes and that mirror quality does not degrade due to the lens array assembly process.