Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009598
S. Ogata, Eiji Sukegawa, Takahiro Kimura
The influence of gas penetration on the lifetime of an ultra-thin polymer pulsating heat pipe (PPHP) was studied experimentally using two types of PPHPs. One type was made with bare polyethylene terephthalate (PET) films and was 0.4 mm thick. The other was covered by gas-barrier films and was 0.48 mm thick. First we compared the performance degradation of the PPHPs made with bare PET films exposed to environments with difference air pressures. The performance of the PPHP exposed to an atmospheric-pressure degraded within a few days, whereas that of the PPHP exposed to a low-pressure environment was maintained for about one month. Next we exposed a PPHP covered by gas-barrier films to an atmospheric-pressure and evaluated its performance change. As a result, the performance of the PPHP with gas-barrier films didn't degrade for more than two weeks. These results show that the gas penetration is a dominant factor in the performance degradation of PPHPs and their lifetime can be increased by using gas-barrier films for their casing materials.
{"title":"Lifetime evaluation of ultra-thin polymer pulsating heat pipe","authors":"S. Ogata, Eiji Sukegawa, Takahiro Kimura","doi":"10.1109/ICSJ.2014.7009598","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009598","url":null,"abstract":"The influence of gas penetration on the lifetime of an ultra-thin polymer pulsating heat pipe (PPHP) was studied experimentally using two types of PPHPs. One type was made with bare polyethylene terephthalate (PET) films and was 0.4 mm thick. The other was covered by gas-barrier films and was 0.48 mm thick. First we compared the performance degradation of the PPHPs made with bare PET films exposed to environments with difference air pressures. The performance of the PPHP exposed to an atmospheric-pressure degraded within a few days, whereas that of the PPHP exposed to a low-pressure environment was maintained for about one month. Next we exposed a PPHP covered by gas-barrier films to an atmospheric-pressure and evaluated its performance change. As a result, the performance of the PPHP with gas-barrier films didn't degrade for more than two weeks. These results show that the gas penetration is a dominant factor in the performance degradation of PPHPs and their lifetime can be increased by using gas-barrier films for their casing materials.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127550262","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009596
Shinya Hasegawa, M. Shinagawa, S. Toyoda, M. Ueno, Y. Sasaki, J. Kobayashi
We estimated the jitter of optical coherence tomography using a swept light source (SS-OCT) with methods of phase locking and Fourier transform. Phase locking could not be applied to estimating the jitter in fringe waveforms when there was a large dependence of voltage noise on time, but the dependence of jitter on local position could be estimated. We found that the Fourier transform could precisely estimate jitter even if there was a large amount of voltage noise. Jitter obtained with the Fourier transform agreed with previous results obtained through cross correlation.
{"title":"Phase stability analysis of swept light source with KTa1−xNbxO3 electro-optic deflector toward Doppler optical coherence tomography","authors":"Shinya Hasegawa, M. Shinagawa, S. Toyoda, M. Ueno, Y. Sasaki, J. Kobayashi","doi":"10.1109/ICSJ.2014.7009596","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009596","url":null,"abstract":"We estimated the jitter of optical coherence tomography using a swept light source (SS-OCT) with methods of phase locking and Fourier transform. Phase locking could not be applied to estimating the jitter in fringe waveforms when there was a large dependence of voltage noise on time, but the dependence of jitter on local position could be estimated. We found that the Fourier transform could precisely estimate jitter even if there was a large amount of voltage noise. Jitter obtained with the Fourier transform agreed with previous results obtained through cross correlation.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"55 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125560218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009621
K. Kitamura, K. Nakai, H. Matsui, T. Nagao, Y. Norimitsu
Fan-out process is one of the major technologies within WLP(Wafer Level Package), where silicon chips are buried into the mold substrate. (Fan-Out WLP)(Fig.1, 2)[1] We have developed the exposure system applying advantage of direct imaging technology with using no-mask or reticle. The system has the capability of compensating displacement of the chips on the reconfigured substrate. We have been successful that the system was able to do alignment exposure with accuracy of equal or less than 2um at |Ave.| + 3 σ.
{"title":"Novel exposure system for FOWLP and MCM photolithopraphy process","authors":"K. Kitamura, K. Nakai, H. Matsui, T. Nagao, Y. Norimitsu","doi":"10.1109/ICSJ.2014.7009621","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009621","url":null,"abstract":"Fan-out process is one of the major technologies within WLP(Wafer Level Package), where silicon chips are buried into the mold substrate. (Fan-Out WLP)(Fig.1, 2)[1] We have developed the exposure system applying advantage of direct imaging technology with using no-mask or reticle. The system has the capability of compensating displacement of the chips on the reconfigured substrate. We have been successful that the system was able to do alignment exposure with accuracy of equal or less than 2um at |Ave.| + 3 σ.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"92 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122941635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009609
Kazunori Maruyama, Sachihiro Youoku, Takeshi Matsumoto, Y. Nishiyama, Y. Endo, S. Sekiguchi, S. Wakana
We propose a passive optical alignment method between multichannel silicon waveguides with spot size converters and a single-mode fiber array. In this method, highly accurate positional and angular alignment is realized by a novel monitoring technique of the waveguide and the fiber in one field of view. We achieve a simultaneous accurate multichannel coupling using a developed assembly system.
{"title":"Direct core monitoring technique for passive optical alignment between multichannel silicon waveguide and single-mode fiber array","authors":"Kazunori Maruyama, Sachihiro Youoku, Takeshi Matsumoto, Y. Nishiyama, Y. Endo, S. Sekiguchi, S. Wakana","doi":"10.1109/ICSJ.2014.7009609","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009609","url":null,"abstract":"We propose a passive optical alignment method between multichannel silicon waveguides with spot size converters and a single-mode fiber array. In this method, highly accurate positional and angular alignment is realized by a novel monitoring technique of the waveguide and the fiber in one field of view. We achieve a simultaneous accurate multichannel coupling using a developed assembly system.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128434482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009607
Jl Leou, Vincent Chen, Jj Chen, Thomas Wang, Harrison Chang
This paper describes a miniaturized LTE SiP modem target for the smallest form factor among the product category. A Novel compartment shielding process is used to implement multiple shielded areas to reduce the interference between digital, analog and RF circuits. The result shows that this modem has excellent RF performance and meets all 3GPP LTE Category 3 (downlink speed can reach 100Mbps) and carrier's requirements. This SiP module passed FCC and CE EMI regulatory tests, and also passed GCF and PTCRB certification. Also, the reliability test shows this process meets consumer applications such as LTE modem for tablet. It is found that this compartment shielding process is good for consumer grade SiP module both in technology and in commercial terms.
{"title":"Miniaturized LTE modem SiP using novel multiple compartments shielding","authors":"Jl Leou, Vincent Chen, Jj Chen, Thomas Wang, Harrison Chang","doi":"10.1109/ICSJ.2014.7009607","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009607","url":null,"abstract":"This paper describes a miniaturized LTE SiP modem target for the smallest form factor among the product category. A Novel compartment shielding process is used to implement multiple shielded areas to reduce the interference between digital, analog and RF circuits. The result shows that this modem has excellent RF performance and meets all 3GPP LTE Category 3 (downlink speed can reach 100Mbps) and carrier's requirements. This SiP module passed FCC and CE EMI regulatory tests, and also passed GCF and PTCRB certification. Also, the reliability test shows this process meets consumer applications such as LTE modem for tablet. It is found that this compartment shielding process is good for consumer grade SiP module both in technology and in commercial terms.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115743781","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009630
T. Nishida, Y. Higo, H. Tanigawa, K. Suzuki
In order to clarify the source of resonant frequency drift in MEMS resonators, thermal expansion effect of packaging on MEMS devices was investigated. The strain in a silicon plate bonded on an aluminum plate with temperature was precisely measured. Increasing amount of strain in the aluminum plate was as large as 200 micro-strain with increase in only 20 degrees of temperature. The strain in the silicon plate was in a same order of change, however, compressive. Thermal expansion coefficient in Al is approximately ten times of that in Si. The reason of the opposite tendency in strain was speculated to be caused by bending in a Si-Al plate.
{"title":"Influence of packaging on frequency drift in MEMS resonators-Dynamic effect of packaging on MEMS device performance","authors":"T. Nishida, Y. Higo, H. Tanigawa, K. Suzuki","doi":"10.1109/ICSJ.2014.7009630","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009630","url":null,"abstract":"In order to clarify the source of resonant frequency drift in MEMS resonators, thermal expansion effect of packaging on MEMS devices was investigated. The strain in a silicon plate bonded on an aluminum plate with temperature was precisely measured. Increasing amount of strain in the aluminum plate was as large as 200 micro-strain with increase in only 20 degrees of temperature. The strain in the silicon plate was in a same order of change, however, compressive. Thermal expansion coefficient in Al is approximately ten times of that in Si. The reason of the opposite tendency in strain was speculated to be caused by bending in a Si-Al plate.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132460621","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009610
Y. Taira, H. Numata, T. Barwicz
Silicon nanophtonics technology brings huge advances to telecom, datacom and computer communication. The use of this technology requires a cost effective method of optical input/output coupling with the external fiber cable. Use of the optical polymer waveguides enables a versatile coupling method. Because the optical signals are in a single mode, tighter positioning accuracy is necessary to realize a low loss coupling. We report the analysis of the alignment method of optical connector to connect the polymer and fibers and describe a new method to improve the positioning accuracy.
{"title":"Precision assembly of polymer waveguide components for silicon photonic packaging","authors":"Y. Taira, H. Numata, T. Barwicz","doi":"10.1109/ICSJ.2014.7009610","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009610","url":null,"abstract":"Silicon nanophtonics technology brings huge advances to telecom, datacom and computer communication. The use of this technology requires a cost effective method of optical input/output coupling with the external fiber cable. Use of the optical polymer waveguides enables a versatile coupling method. Because the optical signals are in a single mode, tighter positioning accuracy is necessary to realize a low loss coupling. We report the analysis of the alignment method of optical connector to connect the polymer and fibers and describe a new method to improve the positioning accuracy.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"38 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123661529","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009608
Takanori Shimizu, N. Hatori, M. Ishizaka, Tsuyoshi Yamamoto, Takahiro Nakamura, M. Okano, M. Mori, Y. Arakawa
A multi-channel hybrid integrated light source with laser diode (LD) arrays on a silicon waveguide platform was developed. The configuration of the light source was optimized to minimize power consumption by considering of the thermal interference between the channels in an LD array and also between the LD array chips. On the basis of the optimization, an over-1000-channel light source was demonstrated to have an over-10-Tbit/s bandwidth optical interconnection. The hybrid integrated light source should be easily adaptable to a photonics-electronics convergence system for ultra-high-bandwidth interchip interconnections.
{"title":"Over-1000-channel hybrid integrated light source with laser diode arrays on a silicon waveguide platform for ultra-high-bandwidth optical interconnections","authors":"Takanori Shimizu, N. Hatori, M. Ishizaka, Tsuyoshi Yamamoto, Takahiro Nakamura, M. Okano, M. Mori, Y. Arakawa","doi":"10.1109/ICSJ.2014.7009608","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009608","url":null,"abstract":"A multi-channel hybrid integrated light source with laser diode (LD) arrays on a silicon waveguide platform was developed. The configuration of the light source was optimized to minimize power consumption by considering of the thermal interference between the channels in an LD array and also between the LD array chips. On the basis of the optimization, an over-1000-channel light source was demonstrated to have an over-10-Tbit/s bandwidth optical interconnection. The hybrid integrated light source should be easily adaptable to a photonics-electronics convergence system for ultra-high-bandwidth interchip interconnections.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124416511","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009604
Ryohei Kataoka, K. Kondo, Jun Akimich, Y. Akiyama, K. Hashimoto, K. Otsuka
Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over 300mm length is therefore needed in each layer. We have developed an LCP board with 28Gbps bandwidth along with a 300mm wiring length,. The board can be produced using DENSO's PALAP process, which is useful for high-density solutions involving more than 100 layers.
{"title":"High speed LCP board for 28Gbps transmission through 300mm","authors":"Ryohei Kataoka, K. Kondo, Jun Akimich, Y. Akiyama, K. Hashimoto, K. Otsuka","doi":"10.1109/ICSJ.2014.7009604","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009604","url":null,"abstract":"Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over 300mm length is therefore needed in each layer. We have developed an LCP board with 28Gbps bandwidth along with a 300mm wiring length,. The board can be produced using DENSO's PALAP process, which is useful for high-density solutions involving more than 100 layers.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121097495","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-01DOI: 10.1109/ICSJ.2014.7009618
Hsiang-Han Hsu, S. Nakagawa
Sources of loss occurred in optical MCM (multi-chip module) based optical link is investigated by simulations. An optical MCM is composed of an organic substrate, polymer waveguides, optochips, and connectors. In an optical link, two optical MCMs played as data transmitter (TX) and receiver (RX) are connected by a multimode fiber (MMF). Polymer waveguides are laminated and optochips are flip chip bonded on the organic substrate. At the entrance and end of each waveguide, there are a pair of turning mirrors. In TX, the light is emitted by a vertical-cavity surface-emitting laser (VCSEL) and then go through the upper cladding layer. After reflected by a turning mirror the light propagates along a 1-cm long straight polymer waveguide. At the waveguide end, light is reflected again and propagate toward a MMF. Coupling between waveguide and MMF is realized by a double lens connector. In RX, light comes from the MMF and propagates as similar way, and is collected by a photo diode (PD). The total link loss includes loss caused by turning mirror roughness is about 5 dB. This helps us to optimize link design for dense aligned high-speed optical MCM link system.
{"title":"Loss analysis for optical MCM based optical link","authors":"Hsiang-Han Hsu, S. Nakagawa","doi":"10.1109/ICSJ.2014.7009618","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009618","url":null,"abstract":"Sources of loss occurred in optical MCM (multi-chip module) based optical link is investigated by simulations. An optical MCM is composed of an organic substrate, polymer waveguides, optochips, and connectors. In an optical link, two optical MCMs played as data transmitter (TX) and receiver (RX) are connected by a multimode fiber (MMF). Polymer waveguides are laminated and optochips are flip chip bonded on the organic substrate. At the entrance and end of each waveguide, there are a pair of turning mirrors. In TX, the light is emitted by a vertical-cavity surface-emitting laser (VCSEL) and then go through the upper cladding layer. After reflected by a turning mirror the light propagates along a 1-cm long straight polymer waveguide. At the waveguide end, light is reflected again and propagate toward a MMF. Coupling between waveguide and MMF is realized by a double lens connector. In RX, light comes from the MMF and propagates as similar way, and is collected by a photo diode (PD). The total link loss includes loss caused by turning mirror roughness is about 5 dB. This helps us to optimize link design for dense aligned high-speed optical MCM link system.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125769841","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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