A CWDM photoreceiver module for 10 Gb/s x 4ch interconnection based on a vertical-illumination-type Ge-on-Si photodetectors and a silica-based AWG

Ki-seok Jang, Jiho Joo, Taeyong Kim, Sanghoon Kim, J. Oh, I. Kim, Sun Ae Kim, Gyungock Kim
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Abstract

We report a 40 Gb/s photoreceiver based on vertical-illumination type Ge-on-Si photodetectors and a silica-based AWG demultiplexer by employing 4-channel CWDM. The 60um-diameter Ge-on-Si photodetector arrays, grown on a bulk silicon wafer by RPCVD and fabricated with CMOS-compatible process, have ~0.9 A/W responsivity with 13 GHz bandwidth at λ ~ 1330nm. Ge-on-Si photodetector arrays are hybrid-integrated with TIA/LAs and directly-coupled to the AWG. The low-cost FPCB-package based photoreceiver module shows 10.3 Gb/s × 4-channel interconnection with -11 ~ -12.2 dBm sensitivity at a BER = 10-12.
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基于垂直照明型锗硅光电探测器和硅基AWG的10gb /s × 4ch互连CWDM光接收器模块
我们报道了一种基于垂直照明型锗硅光电探测器的40 Gb/s光接收器和采用4通道CWDM的硅基AWG解复用器。利用RPCVD技术在块体硅片上生长的60微米直径的锗硅光电探测器阵列,在λ ~ 1330nm处具有~0.9 a /W的响应率和13ghz的带宽。Ge-on-Si光电探测器阵列与TIA/LAs混合集成,并直接耦合到AWG。基于低成本fpcb封装的光电接收器模块在BER = 10-12时具有10.3 Gb/s × 4通道互连,灵敏度为-11 ~ -12.2 dBm。
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