Analysis of substrate noise propagation in a lightly doped substrate [mixed-signal ICs]

G. van der Plas, C. Soens, G. Vandersteen, P. Wambacq, S. Donnay
{"title":"Analysis of substrate noise propagation in a lightly doped substrate [mixed-signal ICs]","authors":"G. van der Plas, C. Soens, G. Vandersteen, P. Wambacq, S. Donnay","doi":"10.1109/ESSDER.2004.1356564","DOIUrl":null,"url":null,"abstract":"Analysis and simulation results of substrate noise in mixed-signal ICs on lightly doped substrates are difficult to bring in agreement with measurements, even for very simple structures. In this paper, substrate noise propagation in lightly doped p-type substrates is studied with a simple test structure. Our study reveals that the current flow is multi-dimensional, and that adjacent layout details (such as nwells and metal wires) influence the propagation between two contacts. The analysis has enabled its to match the measured S/sub 21/ propagation with a simulation model from DC (error<8%) up to 10 GHz with an overall error smaller than 3 dB. Insight in simple structures such as the one considered here, is valuable in improving the understanding of substrate noise in lightly doped substrates.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDER.2004.1356564","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

Abstract

Analysis and simulation results of substrate noise in mixed-signal ICs on lightly doped substrates are difficult to bring in agreement with measurements, even for very simple structures. In this paper, substrate noise propagation in lightly doped p-type substrates is studied with a simple test structure. Our study reveals that the current flow is multi-dimensional, and that adjacent layout details (such as nwells and metal wires) influence the propagation between two contacts. The analysis has enabled its to match the measured S/sub 21/ propagation with a simulation model from DC (error<8%) up to 10 GHz with an overall error smaller than 3 dB. Insight in simple structures such as the one considered here, is valuable in improving the understanding of substrate noise in lightly doped substrates.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
轻掺杂衬底中衬底噪声传播分析[混合信号集成电路]
在轻掺杂衬底上混合信号集成电路的衬底噪声分析和仿真结果很难与测量结果一致,即使是非常简单的结构。本文采用简单的测试结构,研究了衬底噪声在轻掺杂p型衬底中的传播。我们的研究表明,电流流动是多维的,相邻的布局细节(如井和金属线)影响两个触点之间的传播。该分析使其能够将测量的S/sub / 21/传播与直流(误差<8%)至10 GHz的仿真模型相匹配,总体误差小于3 dB。对简单结构的洞察,如这里所考虑的,对于提高对轻掺杂衬底中衬底噪声的理解是有价值的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Bias stress in pentacene transistors measured by four probe transistor structures Interface passivation mechanisms in metal gated oxide capacitors Modeling of STI-induced stress phenomena in CMOS 90nm Flash technology A novel method for forming gate spacer and its effects on the W/WN/sub x//poly-Si gate stack Gate-capacitance extraction from RF C-V measurements [MOS device applications]
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1