Electromigration Failure in Au Thin-Film Conductors

B. Agarwala
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引用次数: 5

Abstract

Experiments are carried out to understand the electromigration-induced failure mechanism in thin-film Au conductors. The activation energy for the atom transport and the magnitude of the current exponent In the failure equation are obtained. The role of surface coverage on the reliability of AU stripes is studied. The underlying mode of atom transport and the possible sources of flux divergences are discussed in terms of these results.
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金薄膜导体的电迁移失效
通过实验研究了金薄膜导体的电迁移失效机理。得到了原子输运的活化能和失效方程中电流指数的大小。研究了表面覆盖度对AU条纹可靠性的影响。根据这些结果讨论了原子输运的基本模式和可能的通量发散源。
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